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OMAPL137BZKBD4

Texas Instruments

OMAPL137BZKBD4 by Texas Instruments

OMAPL137BZKBD4 by Texas Instruments is a DSP with 16-bit external data bus, 456 MHz clock frequency, and 13-bit address bus width. Ideal for industrial applications requiring low power mode and floating point format processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,272 parts In-Stock

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Digiode

USA . 718 parts In-Stock

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718

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One Stop Electronics

USA . 1,375 parts In-Stock

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$4.000

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$4.000

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AZTECH Wire

Italy . 709 parts In-Stock

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$7.473

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709

$7.473

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$15.993

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$14.554

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$13.114

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3,000

$15.993

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$13.114

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Corohmni

South Africa . 657 parts In-Stock

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$20.260

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657

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Parana Technologies

USA . 1,321 parts In-Stock

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$28.803

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$52.011

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1,321

$28.803

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$52.011

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DigiPath Technology Company

USA . 1,073 parts In-Stock

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$31.716

100+ parts

$29.178

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1,073

$31.716

$29.178

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ChromeModa Solutions

Germany . 5,740 parts In-Stock

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$32.363

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$26.538

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$32.363

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IDEA Electronic Components Group

UK . 2,157 parts In-Stock

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$32.363

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$30.745

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$29.127

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2,157

$32.363

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$29.127

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Corphita

USA . 1,739 parts In-Stock

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Microchip USA

USA . 476 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the OMAPL137BZKBD4 by Texas Instruments, a leading manufacturer known for top-quality products. This Digital Signal Processor (DSP) offers unparalleled performance and versatility in a compact package, making it ideal for a wide range of applications. Whether you're a tech enthusiast, a DIY hobbyist, or a professional in the industry, this innovative product delivers exceptional value, benefits, and advantages that will take your projects to the next level. Upgrade your arsenal with the OMAPL137BZKBD4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the DSP, making it suitable for a variety of applications.

Maximum Supply Voltage: 1.35 V

The maximum supply voltage of 1.35 V allows for efficient power usage and compatibility with a wide range of electronic systems.

Maximum Clock Frequency: 456 MHz

The high maximum clock frequency of 456 MHz enables fast data processing and high performance for signal processing applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making this DSP suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type as a digital signal processor ensures efficient signal processing capabilities, making this product suitable for digital audio, telecommunications, and other signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137BZKBD4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

456 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

OMAPL137BZKBD4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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