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OMAPL137BZKB4

Texas Instruments

OMAPL137BZKB4 by Texas Instruments

OMAPL137BZKB4 by Texas Instruments is a DSP with 16-bit external data bus, 456 MHz clock frequency, and 13-bit address bus width. Ideal for digital signal processing applications requiring low power mode and floating point format in a compact grid array package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,867 parts In-Stock

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5,867

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Digiode

USA . 2,154 parts In-Stock

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2,154

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Distributors (Availability)

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Andel Nordic

Denmark . 4,177 parts In-Stock

1+ parts

$4.801

100+ parts

-

1k+ parts

$4.609

10k+ parts

$4.609

4,177

$4.801

-

$4.609

$4.609

AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$7.047

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783

$7.047

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One Stop Electronics

USA . 488 parts In-Stock

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$13.000

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488

$13.000

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Corohmni

South Africa . 30 parts In-Stock

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$17.484

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30

$17.484

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Parana Technologies

USA . 1,233 parts In-Stock

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$38.202

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1,233

$38.202

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DigiPath Technology Company

USA . 1,018 parts In-Stock

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$42.066

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1,018

$42.066

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ChromeModa Solutions

Germany . 2,272 parts In-Stock

1+ parts

$42.924

100+ parts

$35.198

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2,272

$42.924

$35.198

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IDEA Electronic Components Group

UK . 1,125 parts In-Stock

1+ parts

$42.924

100+ parts

$40.778

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$38.632

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1,125

$42.924

$40.778

$38.632

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Corphita

USA . 4,703 parts In-Stock

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4,703

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Microchip USA

USA . 444 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the OMAPL137BZKB4 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. This versatile product is perfect for a wide range of applications, offering customers a seamless experience. With its advanced features and high performance, the OMAPL137BZKB4 provides exceptional value and benefits, making it the ideal choice for your next project. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body makes the product lightweight and durable, allowing for easy handling and longer lifespan.

Surface Mount: YES

The surface mount feature enables easy installation and integration of the product onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.35 V

The maximum supply voltage of 1.35 V ensures efficient power consumption and prevents potential damage to the product from overvoltage.

Address Bus Width: 13

With a wide address bus width of 13, the product can efficiently handle complex calculations and operations, leading to high-performance processing capabilities.

Package Shape: SQUARE

The square package shape allows for easy stacking and arranging of multiple products in a compact space, making it ideal for applications with limited room for components.

Power Supplies (V): 1.2,1.8/3.3

The availability of multiple power supply options allows for flexible usage in different environments and scenarios, ensuring compatibility with various power sources.

No. of Terminals: 256

Having a high number of terminals (256) provides ample connectivity options and compatibility with a wide range of interfaces and peripherals, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy soldering and mounting onto circuit boards, ensuring reliable connections and stable performance.

Minimum Supply Voltage: 1.25 V

The minimum supply voltage of 1.25 V ensures stable operation even under low power conditions, making the product suitable for energy-efficient applications.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, the product can withstand harsh environmental conditions and prolonged usage without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows the product to function reliably in cold environments, ensuring consistent performance regardless of temperature variations.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper in terminal finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the product's overall reliability and longevity.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easier PCB layout and routing, simplifying the design and assembly process for the product.

Maximum Seated Height: 2.05 mm

The maximum seated height of 2.05 mm ensures a compact form factor, making the product suitable for space-constrained applications where height restrictions apply.

Width: 17 mm

With a width of 17 mm, the product can efficiently fit into standard-size enclosures and PCB layouts, ensuring compatibility with existing equipment and designs.

Boundary Scan: YES

The boundary scan feature allows for easy testing and debugging of the product during manufacturing, reducing time and cost involved in quality assurance processes.

External Data Bus Width: 16

The external data bus width of 16 enables high-speed data transfer between the product and external devices, improving overall system performance and responsiveness.

Maximum Clock Frequency: 456 MHz

With a high maximum clock frequency of 456 MHz, the product can execute instructions and process data swiftly, delivering real-time performance for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 260°C within 30 seconds ensures reliable soldering and assembly processes, preventing thermal damage to the product.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and bonding of components, resulting in robust connections and improved reliability of the product.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data processing efficiency and allows for parallel operations, optimizing performance and throughput of the product.

Length: 17 mm

With a length of 17 mm, the product's compact size enables easy integration into tight spaces and compact designs, making it suitable for small form factor applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with various other peripheral functions, the product provides versatile processing capabilities and functionality, making it a comprehensive solution for diverse applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high noise immunity, and reliable operation, making it suitable for battery-powered and noise-sensitive applications.

Terminal Form: BALL

The ball terminal form facilitates easy and reliable soldering, ensuring secure connections and stable operation during the product's lifecycle.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V provides a stable operating voltage for the product, minimizing power fluctuations and ensuring consistent performance under varying load conditions.

Terminal Pitch: 1 mm

The 1 mm terminal pitch allows for precise and compact arrangement of terminals, enabling high-density PCB designs and efficient use of available space.

Format: FLOATING POINT

The floating-point format used in the product allows for accurate and efficient computation of decimal numbers, enhancing the precision and performance of mathematical operations.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product is resistant to moisture absorption, ensuring reliability and longevity even in humid environments.

Low Power Mode: YES

The low power mode feature enables the product to operate in a power-efficient state, reducing energy consumption and extending battery life in portable and energy-conscious applications.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL137BZKB4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

456 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

OMAPL137BZKB4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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