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OMAP3503ECUS

Texas Instruments

OMAP3503ECUS by Texas Instruments

OMAP3503ECUS by Texas Instruments is a DSP with 32-bit on-chip data RAM, 32768 RAM words, and max clock frequency of 59 MHz. It is used in applications requiring low power mode, such as digital signal processing tasks in various electronic devices.

Median Price

$29.150

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 47 parts In-Stock

1+ parts

$4.954

100+ parts

-

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-

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47

$4.954

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Chip1Stop

Japan . 47 parts In-Stock

1+ parts

$24.500

100+ parts

-

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47

$24.500

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Texas Instruments

USA . 2,063 parts In-Stock

1+ parts

$31.016

100+ parts

$27.570

1k+ parts

$20.272

10k+ parts

-

2,063

$31.016

$27.570

$20.272

-

Rochester

USA . 132 parts In-Stock

1+ parts

-

100+ parts

$29.150

1k+ parts

$26.080

10k+ parts

$24.540

132

-

$29.150

$26.080

$24.540

DigiKey

USA . 132 parts In-Stock

1+ parts

-

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132

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Verical

USA . 88 parts In-Stock

1+ parts

-

100+ parts

$36.438

1k+ parts

$32.600

10k+ parts

$30.675

88

-

$36.438

$32.600

$30.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,349 parts In-Stock

1+ parts

$4.706

100+ parts

-

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4,349

$4.706

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Bristol Electronics

USA . 90 parts In-Stock

1+ parts

$26.554

100+ parts

$23.489

1k+ parts

-

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90

$26.554

$23.489

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Vyrian

USA . 7,857 parts In-Stock

1+ parts

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7,857

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DigiKey Marketplace

USA . 132 parts In-Stock

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132

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

1+ parts

-

100+ parts

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90

-

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Dan-Mar Components

USA . 90 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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90

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,783 parts In-Stock

1+ parts

$4.459

100+ parts

-

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4,783

$4.459

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Corohmni

South Africa . 5,240 parts In-Stock

1+ parts

$36.713

100+ parts

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5,240

$36.713

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Parana Technologies

USA . 1,144 parts In-Stock

1+ parts

$63.966

100+ parts

-

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1,144

$63.966

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DigiPath Technology Company

USA . 1,240 parts In-Stock

1+ parts

$70.435

100+ parts

$64.800

1k+ parts

-

10k+ parts

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1,240

$70.435

$64.800

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ChromeModa Solutions

Germany . 1,846 parts In-Stock

1+ parts

$71.872

100+ parts

$58.935

1k+ parts

-

10k+ parts

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1,846

$71.872

$58.935

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IDEA Electronic Components Group

UK . 1,131 parts In-Stock

1+ parts

$71.872

100+ parts

$68.278

1k+ parts

$64.685

10k+ parts

-

1,131

$71.872

$68.278

$64.685

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QUARKTWIN TECHNOLOGY LTD

USA . 26,040 parts In-Stock

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26,040

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Lixinc

USA . 19,817 parts In-Stock

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19,817

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A-Z Elektronik GmbH

Germany . 4,670 parts In-Stock

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4,670

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,221 parts In-Stock

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1,221

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Futuretech Components

Singapore . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 90 parts In-Stock

1+ parts

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90

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Overview

Unlock the power of cutting-edge technology with the OMAP3503ECUS by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This versatile product is perfect for a wide range of applications, offering customers unmatched performance and efficiency. With integrated cache and low power mode, the OMAP3503ECUS provides exceptional value and benefits to meet all your DSP needs. Experience the advantages of Texas Instruments' innovation with this high-quality product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the DSP, making it reliable for long-term use.

Integrated Cache: YES

Having an integrated cache helps in reducing the memory access time, improving the overall performance of the DSP.

Maximum Supply Voltage: 1.91 V

Allows for higher voltage input without risking damage to the DSP, providing flexibility in power supply.

On Chip Data RAM Width: 32

The wider data RAM width allows for higher processing capabilities and greater efficiency in handling large amounts of data.

Surface Mount: YES

Surface mount technology enables easy installation and replacement of the DSP in various electronics applications.

No. of Terminals: 423

A higher number of terminals provide more connectivity options and compatibility with different circuit configurations.

Maximum Operating Temperature: 90 °C

With a high operating temperature range, this DSP can be used in a variety of environments without overheating issues.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral ICs enhances the functionality and versatility of the product.

Technology: CMOS

The CMOS technology used in this DSP ensures low power consumption and high performance, making it energy-efficient.

No. of DMA Channels: 32

Having multiple DMA channels allows for efficient data transfer and management, improving the overall processing speed of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3503ECUS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

59 MHz

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

32

No. of Terminals:

423

No. of Timers:

15

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

720 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.91 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAP3503ECUS Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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