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MSP430F67781IPEU

Texas Instruments

MSP430F67781IPEU by Texas Instruments

MSP430F67781IPEU by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.6 V, making it ideal for industrial applications requiring low power consumption and high performance. With I2C, SPI, and UART compatibility, this MICROPROCESSOR CIRCUIT is suitable for various embedded systems designs.

Median Price

$11.286

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 805 parts In-Stock

1+ parts

$11.286

100+ parts

$9.859

1k+ parts

$6.799

10k+ parts

-

805

$11.286

$9.859

$6.799

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,133 parts In-Stock

1+ parts

$10.722

100+ parts

-

1k+ parts

-

10k+ parts

-

4,133

$10.722

-

-

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Vyrian

USA . 3,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,713

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,865 parts In-Stock

1+ parts

$10.157

100+ parts

-

1k+ parts

-

10k+ parts

-

1,865

$10.157

-

-

-

Corohmni

South Africa . 1,226 parts In-Stock

1+ parts

$12.878

100+ parts

-

1k+ parts

-

10k+ parts

-

1,226

$12.878

-

-

-

AZTECH Wire

Italy . 138 parts In-Stock

1+ parts

$21.710

100+ parts

-

1k+ parts

-

10k+ parts

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138

$21.710

-

-

-

Microchip USA

USA . 2,791 parts In-Stock

1+ parts

$35.570

100+ parts

$35.060

1k+ parts

$34.810

10k+ parts

$34.550

2,791

$35.570

$35.060

$34.810

$34.550

Parana Technologies

USA . 97 parts In-Stock

1+ parts

$64.400

100+ parts

-

1k+ parts

-

10k+ parts

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97

$64.400

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DigiPath Technology Company

USA . 1,618 parts In-Stock

1+ parts

$70.912

100+ parts

$65.239

1k+ parts

-

10k+ parts

-

1,618

$70.912

$65.239

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-

ChromeModa Solutions

Germany . 6,168 parts In-Stock

1+ parts

$72.359

100+ parts

$59.334

1k+ parts

-

10k+ parts

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6,168

$72.359

$59.334

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IDEA Electronic Components Group

UK . 434 parts In-Stock

1+ parts

$72.359

100+ parts

$68.741

1k+ parts

$65.123

10k+ parts

-

434

$72.359

$68.741

$65.123

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

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Overview

Unlock the potential of your electronic projects with the Texas Instruments MSP430F67781IPEU. This innovative microprocessor circuit offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, from IoT devices to industrial automation, this versatile chip provides efficient power management and high-speed processing capabilities. Experience the value of seamless integration and superior performance with the MSP430F67781IPEU, the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging provides a cost-effective and durable solution for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V enables compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient usage of space on the circuit board.

Bit Size: 16

16-bit processing capability offers enhanced computational power for the product.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages provides flexibility in terms of power input options.

No. of Terminals: 128

Having 128 terminals allows for versatile connectivity and integration within a circuit.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enhances the product's compactness and suitability for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V ensures efficient power consumption and operation at lower voltage levels.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is suitable for industrial settings where high temperatures may be encountered.

CPU Family: MSP430

Being part of the MSP430 CPU family signifies high performance, low power consumption, and robust features.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures reliable and long-lasting connectivity.

ADC Channels: YES

Integration of ADC channels allows for analog-to-digital conversion, enhancing the product's versatility.

Terminal Position: QUAD

Quad terminal position enables efficient placement and connection of the product within a circuit.

ROM Words: 524288

The large ROM capacity of 524288 words provides ample storage for firmware and program data.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm minimizes the overall profile of the product for space-efficient designs.

RAM Words: 16

16 RAM words offer temporary storage for data during processing, enhancing the product's operational efficiency.

Width: 14 mm

14mm width ensures compatibility with standard board layouts and spacing requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Product can withstand peak reflow temperatures for up to 30 seconds during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures secure soldering and assembly.

Length: 20 mm

20mm length allows for easy integration and placement within circuit designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit enhances the product's processing capabilities and functionality.

RAM Bytes: 16384

Large RAM capacity of 16384 bytes enables efficient data storage and manipulation during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for optimal performance.

Terminal Form: GULL WING

Gull-wing terminal form facilitates easy soldering and connection onto circuit boards.

Maximum Supply Current: 11.75 mA

Low maximum supply current of 11.75mA ensures energy efficiency during operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates and customization.

Bus Compatibility: I2C; SPI; UART

Compatibility with various bus interfaces like I2C, SPI, and UART enables seamless communication with external devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density packing and space-saving in circuit board layouts.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling.

Speed: 25 rpm

Operational speed of 25rpm offers efficient processing and response times for the product's functions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67781IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67781IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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