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MSP430F6775AIPZR

Texas Instruments

MSP430F6775AIPZR by Texas Instruments

MSP430F6775AIPZR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$5.443

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,955 parts In-Stock

1+ parts

$5.443

100+ parts

$4.437

1k+ parts

$2.958

10k+ parts

-

4,955

$5.443

$4.437

$2.958

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,933 parts In-Stock

1+ parts

$5.171

100+ parts

-

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-

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2,933

$5.171

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Chip Stock

USA . 4,100 parts In-Stock

1+ parts

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4,100

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Vyrian

USA . 3,827 parts In-Stock

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3,827

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,689 parts In-Stock

1+ parts

$4.899

100+ parts

-

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-

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3,689

$4.899

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AZTECH Wire

Italy . 866 parts In-Stock

1+ parts

$18.390

100+ parts

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866

$18.390

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Microchip USA

USA . 2,111 parts In-Stock

1+ parts

$26.220

100+ parts

$26.050

1k+ parts

$25.970

10k+ parts

$25.890

2,111

$26.220

$26.050

$25.970

$25.890

Parana Technologies

USA . 2,099 parts In-Stock

1+ parts

$42.451

100+ parts

$3,942.240

1k+ parts

$38.206

10k+ parts

-

2,099

$42.451

$3,942.240

$38.206

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DigiPath Technology Company

USA . 1,894 parts In-Stock

1+ parts

$46.744

100+ parts

$43.005

1k+ parts

-

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1,894

$46.744

$43.005

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ChromeModa Solutions

Germany . 6,405 parts In-Stock

1+ parts

$47.698

100+ parts

$39.112

1k+ parts

-

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6,405

$47.698

$39.112

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IDEA Electronic Components Group

UK . 836 parts In-Stock

1+ parts

$47.698

100+ parts

$45.313

1k+ parts

$42.928

10k+ parts

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836

$47.698

$45.313

$42.928

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Corohmni

South Africa . 226 parts In-Stock

1+ parts

$61.258

100+ parts

-

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226

$61.258

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Component Stockers USA

USA . 231 parts In-Stock

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231

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Overview

Unlock the potential of your next project with the MSP430F6775AIPZR by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This versatile microprocessor circuit offers a wide range of applications, from IoT devices to industrial automation. With advanced features like 6-channel ADCs, PWM channels, and multiple connectivity options, this IC provides unmatched value and performance. Trust Texas Instruments to deliver cutting-edge technology that will take your design to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the uP, uC, or peripheral IC.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages for versatile applications.

CPU Family: MSP430

Known for low power consumption, making it suitable for battery-operated devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates multiple peripherals like BOR, Comparator, DMA, RTC, Timer, and WDT for enhanced functionality.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Offers multiple communication options, enabling easy integration with a variety of other devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6775AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6775AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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