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AM1808EZWT3

Texas Instruments

AM1808EZWT3 by Texas Instruments

AM1808EZWT3 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power applications in various industries like automotive and industrial automation. The package style is grid array, low profile, fine pitch with terminal finish of tin silver copper.

Median Price

$19.910

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 260 parts In-Stock

1+ parts

$13.562

100+ parts

$11.847

1k+ parts

$8.170

10k+ parts

-

260

$13.562

$11.847

$8.170

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Mouser Electronics

USA . 47 parts In-Stock

1+ parts

$19.910

100+ parts

$14.230

1k+ parts

-

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47

$19.910

$14.230

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DigiKey

USA . 40 parts In-Stock

1+ parts

$19.910

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-

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40

$19.910

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,668 parts In-Stock

1+ parts

$12.884

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1,668

$12.884

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Vyrian

USA . 3,381 parts In-Stock

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3,381

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Prism Electronics

USA . 11 parts In-Stock

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11

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Bristol Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 179 parts In-Stock

1+ parts

$10.477

100+ parts

-

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179

$10.477

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Corphita

USA . 1,928 parts In-Stock

1+ parts

$12.206

100+ parts

-

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1,928

$12.206

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Advanced Electronics

New Zealand . 86 parts In-Stock

1+ parts

$41.094

100+ parts

$37.396

1k+ parts

$33.697

10k+ parts

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86

$41.094

$37.396

$33.697

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Parana Technologies

USA . 655 parts In-Stock

1+ parts

$51.114

100+ parts

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655

$51.114

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ChromeModa Solutions

Germany . 5,657 parts In-Stock

1+ parts

$57.431

100+ parts

$47.093

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-

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5,657

$57.431

$47.093

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IDEA Electronic Components Group

UK . 847 parts In-Stock

1+ parts

$57.431

100+ parts

$54.559

1k+ parts

$51.688

10k+ parts

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847

$57.431

$54.559

$51.688

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iodParts Technologies Inc.

India . 7,560 parts In-Stock

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7,560

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Lixinc

USA . 7,488 parts In-Stock

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7,488

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Northwest PG Solutions

USA . 1,849 parts In-Stock

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1,849

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Futuretech Components

Singapore . 1,807 parts In-Stock

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1,807

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A-Z Elektronik GmbH

Germany . 1,080 parts In-Stock

1+ parts

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1,080

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Native Components

USA . 745 parts In-Stock

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745

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DigiPath Technology Company

USA . 358 parts In-Stock

1+ parts

-

100+ parts

$51.780

1k+ parts

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358

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$51.780

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Overview

Unleash the power of cutting-edge technology with the AM1808EZWT3 by Texas Instruments. This top-of-the-line microprocessor boasts integrated cache, low power mode, and a maximum clock frequency of 30 MHz, making it ideal for a wide range of applications. With Texas Instruments' reputation for quality and innovation, you can trust that this product will deliver exceptional performance and reliability. Experience seamless operation and unparalleled efficiency with the AM1808EZWT3, setting new standards in the world of microprocessors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache improves the overall performance and speed of the microprocessor.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage allows for efficient power management and helps prevent overheating.

Address Bus Width: 23

A wider address bus width enables the microprocessor to handle larger amounts of data more efficiently.

Package Shape: SQUARE

The square shape of the package allows for easier installation and compatibility with various systems.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle complex calculations and tasks with ease.

No. of Terminals: 361

Having a high number of terminals allows for more connectivity options and flexibility in system integration.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures that the microprocessor can operate efficiently even at lower power levels.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows for reliable performance in various environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor enables faster and more efficient processing of instructions and tasks.

Technical Specifications

Microprocessors AM1808EZWT3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

375 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM1808EZWT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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