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STGB7NB60KDT4

STMicroelectronics

STGB7NB60KDT4 by STMicroelectronics

STGB7NB60KDT4 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max collector-emitter voltage of 600V, 14A collector current, and operates at up to 150 °C. Ideal for applications requiring high efficiency in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,747 parts In-Stock

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4,747

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Digiode

USA . 2,490 parts In-Stock

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2,490

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Anansix

USA . 607 parts In-Stock

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607

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,956 parts In-Stock

1+ parts

$0.513

100+ parts

-

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$0.462

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1,956

$0.513

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$0.462

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MKK Technologies

India . 517 parts In-Stock

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$0.965

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517

$0.965

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DigiPath Technology Company

USA . 517 parts In-Stock

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$0.965

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517

$0.965

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AZTECH Wire

Italy . 516 parts In-Stock

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$9.230

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516

$9.230

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Corphita

USA . 3,751 parts In-Stock

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3,751

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QUARKTWIN TECHNOLOGY LTD

USA . 3,723 parts In-Stock

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3,723

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Parana Technologies

USA . 1,882 parts In-Stock

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$0.614

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1,882

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$0.614

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Overview

Elevate your power control solutions with the STGB7NB60KDT4 IGBT from STMicroelectronics, a leader in semiconductor innovation. This high-performance, N-channel device combines exceptional efficiency and reliability, making it ideal for demanding applications in industrial automation, renewable energy, and motor drives. With its compact design and built-in diode, you’ll enjoy seamless integration and reduced footprint while maximizing system performance. Choose STMicroelectronics for unmatched quality and expertise—empower your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliable performance in various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are typically more efficient and have better performance characteristics than their P-channel counterparts.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves overall system reliability and performance.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, making it ideal for use in motor drives, inverters, and other energy management solutions.

Surface Mount: YES

Surface mount technology allows for higher density circuit board designs and simplifies manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCB and accommodates a stable mounting.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections, particularly in automated assembly processes.

Nominal Turn Off Time (toff): 202 ns

Fast turn-off time enables high switching speeds, making this IGBT suitable for rapid PWM control applications.

No. of Terminals: 2

A straightforward two-terminal design enhances simplicity in circuit implementation.

Maximum Power Dissipation (Abs): 95 W

With a high power dissipation capacity, this IGBT can handle intense applications, extending device lifecycle.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for compact designs while maintaining performance integrity.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature expands the range of applications and enhances system reliability in harsh environments.

Maximum Collector-Emitter Voltage: 600 V

With a high voltage rating, this IGBT can be used in a variety of high-voltage applications safely.

Transistor Element Material: SILICON

Silicon-based transistors are standard in modern electronics, providing excellent conduction and switching efficiency.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage rating allows for greater flexibility in design and compatibility with numerous driving circuits.

Maximum Collector Current (IC): 14 A

Capable of handling significant current loads, this IGBT is optimal for demanding power supply applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

This threshold voltage ensures reliable operation with standard logic level inputs, streamlining integration into various circuits.

Terminal Finish: MATTE TIN

Matte tin finish minimizes oxidation and enhances solderability, ensuring long-term reliability of the connections.

Terminal Position: SINGLE

Having a single terminal position simplifies the PCB layout and assembly process.

Nominal Turn On Time (ton): 21 ns

A low turn-on time contributes to faster switching capabilities, making this IGBT suitable for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB7NB60KDT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

202 ns

Nominal Turn On Time (ton):

21 ns

Trade Compliance

STGB7NB60KDT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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