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STGB35N35LZT4

STMicroelectronics

STGB35N35LZT4 by STMicroelectronics

STGB35N35LZT4 from STMicroelectronics is an N-channel IGBT ideal for power control applications. It features a max collector-emitter voltage of 380V, 40A collector current, and operates at up to 175 °C. Its compact design ensures efficient performance in surface mount configurations.

Median Price

$1.453

Lifecycle Status

Suppliers In-Stock

7

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1k+

Distributors (Authorized)

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Arrow

USA . 589 parts In-Stock

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$1.026

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Chip1Stop

Japan . 589 parts In-Stock

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$1.880

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$1.880

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Verical

USA . 589 parts In-Stock

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589

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Digiode

USA . 402 parts In-Stock

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$0.975

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402

$0.975

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Vyrian

USA . 2,526 parts In-Stock

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Anansix

USA . 740 parts In-Stock

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ComSIT Distribution GmbH

Germany . 563 parts In-Stock

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Advanced Electronics

New Zealand . 87 parts In-Stock

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$0.362

100+ parts

$0.329

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$0.297

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87

$0.362

$0.329

$0.297

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IDEA Electronic Components Group

UK . 1,434 parts In-Stock

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$0.669

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$0.602

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1,434

$0.669

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$0.602

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Corphita

USA . 4,636 parts In-Stock

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$0.923

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$0.923

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MKK Technologies

India . 565 parts In-Stock

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$1.258

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DigiPath Technology Company

USA . 565 parts In-Stock

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$1.258

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AZTECH Wire

Italy . 548 parts In-Stock

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$9.850

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$9.850

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Kepictronics

USA . 3,500 parts In-Stock

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Parana Technologies

USA . 1,507 parts In-Stock

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$0.800

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Perfect Parts

USA . 1,141 parts In-Stock

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Overview

Elevate your power control systems with the STGB35N35LZT4 from STMicroelectronics, a leader in semiconductor innovation. This high-quality Insulated Gate Bipolar Transistor (IGBT) combines robustness and efficiency, making it perfect for demanding applications like motor drives and renewable energy. With superior thermal performance and reliability, this N-channel device ensures optimal operation in compact designs, delivering unmatched value to engineers and manufacturers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making this IGBT suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel devices typically offer lower on-state resistance, leading to improved efficiency and performance in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor enhance the stability and protection of the IGBT, facilitating ease of integration into circuits.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can handle high voltage and current, making it ideal for power electronics.

Surface Mount: YES

Surface mount capability allows for compact PCB designs and automated assembly, reducing production costs and improving reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on a PCB, contributing to efficient layout designs in electronic products.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, crucial for reliable connections.

Nominal Turn Off Time (toff): 37000 ns

A relatively high turn-off time indicates the ability to manage switching losses effectively, enhancing performance in high-frequency applications.

No. of Terminals: 2

Having only two terminals simplifies the circuit design while still maintaining efficient operation for power control.

Maximum Power Dissipation (Abs): 176 W

With a high power dissipation rating, this IGBT can handle significant power loads, making it suitable for demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is beneficial for minimizing space on the PCB while delivering robust performance.

Maximum Operating Temperature: 175 °C

A high operating temperature limit allows this IGBT to function reliably in harsh environments.

Maximum Collector-Emitter Voltage: 380 V

The ability to support high voltage applications makes this IGBT suitable for a range of industrial power circuits.

Transistor Element Material: SILICON

Silicon as the element material is standard for high-performance power transistors, providing good thermal conductivity and reliability.

Maximum Gate-Emitter Voltage: 12 V

A modest gate-emitter voltage spec allows for compatibility with standard gate drive circuits, simplifying design considerations.

Maximum Collector Current (IC): 40 A

A maximum collector current rating of 40 A permits this IGBT to handle substantial loads, suitable for both industrial and commercial applications.

Maximum Gate-Emitter Threshold Voltage: 2.3 V

A low gate-emitter threshold voltage provides efficient switching capabilities with minimal drive voltage, enhancing overall effectiveness.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and corrosion resistance, enhancing reliability in long-term operations.

Terminal Position: DUAL

The dual terminal position facilitates straightforward PCB mounting and enhances electrical performance.

Case Connection: COLLECTOR

Collector case connection design allows for effective heat dissipation, minimizing thermal resistance during operation.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow temperature time of 30 seconds is suitable for modern PCB soldering processes, ensuring effective assembly.

Peak Reflow Temperature °C: 245

A high peak reflow temperature indicates compatibility with lead-free soldering processes, aligning with environmental regulations.

Nominal Turn On Time (ton): 7600 ns

A nominal turn-on time of 7600 ns suggests improved switching performance, which is critical for high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGB35N35LZT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

VOLTAGE CLAMPING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

380 V

Maximum Gate-Emitter Threshold Voltage:

2.3 V

Maximum Gate-Emitter Voltage:

12 V

JEDEC-95 Code:

TO-263AA

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

37000 ns

Nominal Turn On Time (ton):

7600 ns

Trade Compliance

STGB35N35LZT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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