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SD1728E

STMicroelectronics

SD1728E by STMicroelectronics

SD1728E by STMicroelectronics is a NPN RF Power BJT with 55V VCEO, 40A IC, and 360pF Cob. Ideal for high-frequency amplifier applications, it features a plastic/epoxy package, flat terminals, and operates up to 200 °C. Suitable for surface mount with flange mount style packaging.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,098 parts In-Stock

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3,098

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Anansix

USA . 2,194 parts In-Stock

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2,194

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Digiode

USA . 610 parts In-Stock

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610

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 871 parts In-Stock

1+ parts

$1.726

100+ parts

-

1k+ parts

$1.553

10k+ parts

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871

$1.726

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$1.553

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MKK Technologies

India . 449 parts In-Stock

1+ parts

$3.245

100+ parts

-

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449

$3.245

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DigiPath Technology Company

USA . 449 parts In-Stock

1+ parts

$3.245

100+ parts

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449

$3.245

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Corphita

USA . 3,066 parts In-Stock

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3,066

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Parana Technologies

USA . 967 parts In-Stock

1+ parts

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$2.064

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967

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$2.064

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Overview

Unlock the power of innovation with the SD1728E by STMicroelectronics. As a leading manufacturer in RF Power Bipolar Junction Transistors, this NPN transistor offers unparalleled quality and reliability for amplifier applications. With a maximum collector current of 40A and a maximum collector-emitter voltage of 55V, this transistor is designed to deliver top performance in high-frequency bands. Experience the value and benefits of STMicroelectronics' cutting-edge technology with the SD1728E, providing customers with the advantage they need to excel in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package material provides good insulation and protection for the transistor, ensuring its longevity and reliability.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifiers and other applications due to their higher current capability and faster switching speeds.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity, making it easier to integrate this transistor into various applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in amplifying signals.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, saving space and reducing overall manufacturing costs.

Package Shape: ROUND

Round package shape provides better thermal performance and allows for easy mounting onto heat sinks for improved heat dissipation.

Terminal Form: FLAT

Flat terminals offer easy and secure soldering connections, ensuring stable electrical contact and reliability in the circuit.

Highest Frequency Band: HIGH FREQUENCY BAND

High frequency band allows for fast switching speeds and operation at higher frequencies, making it suitable for high-performance applications.

No. of Terminals: 4

Having 4 terminals provides flexibility in circuit connections and allows for various configurations to be implemented.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for secure mounting and easy integration into systems requiring stable and robust mechanical connections.

Maximum Operating Temperature: 200 °C

Operating at temperatures up to 200 °C ensures reliability and performance under high temperature conditions, making it suitable for demanding environments.

Maximum Collector-Base Capacitance: 360 pF

Low collector-base capacitance minimizes signal distortion and improves high-frequency performance, making it suitable for high-speed applications.

Maximum Collector-Emitter Voltage: 55 V

High collector-emitter voltage rating allows for operation in a wide range of voltage conditions, making it versatile and suitable for various applications.

Transistor Element Material: SILICON

Silicon material offers high performance, reliability, and efficiency in transistor operation, making it a preferred choice for various electronic applications.

Maximum Collector Current (IC): 40 A

High collector current capability allows for handling higher power levels, making it suitable for power amplification and high current applications.

Terminal Position: RADIAL

Radial terminal position simplifies circuit board layout and allows for easier connections in radial configurations, improving overall circuit design.

Technical Specifications

RF Power Bipolar Junction Transistors (BJT) SD1728E attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

360 pF

Maximum Collector-Emitter Voltage:

55 V

Configuration:

Highest Frequency Band:

HIGH FREQUENCY BAND

JESD-30 Code:

O-PRFM-F4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD1728E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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