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SD1728F

STMicroelectronics

SD1728F by STMicroelectronics

SD1728F by STMicroelectronics is a NPN RF Power BJT with 55V VCEO, 40A IC, and 360pF Cob. Ideal for high-frequency amplifier applications, it features a plastic/epoxy package, flat terminals, and operates up to 200 °C. Suitable for surface mount with flange mount style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,069 parts In-Stock

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4,069

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Anansix

USA . 1,223 parts In-Stock

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1,223

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Digiode

USA . 181 parts In-Stock

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181

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,755 parts In-Stock

1+ parts

$1.521

100+ parts

-

1k+ parts

$1.369

10k+ parts

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1,755

$1.521

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$1.369

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MKK Technologies

India . 1,374 parts In-Stock

1+ parts

$2.860

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1,374

$2.860

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DigiPath Technology Company

USA . 1,374 parts In-Stock

1+ parts

$2.860

100+ parts

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1,374

$2.860

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Corphita

USA . 2,381 parts In-Stock

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2,381

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Parana Technologies

USA . 2,107 parts In-Stock

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$1.818

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2,107

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$1.818

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Overview

Experience the cutting-edge technology and superior performance of the SD1728F RF Power Bipolar Junction Transistor by STMicroelectronics. Known for their excellence in semiconductor manufacturing, STMicroelectronics delivers exceptional quality and reliability. This transistor, with its NPN polarity and single configuration, is ideal for amplifier applications in high frequency bands. With a maximum collector current of 40A and a maximum operating temperature of 200 °C, the SD1728F offers unmatched value and benefits to customers seeking top-notch performance in their electronic designs. Elevate your projects with the SD1728F from STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product suitable for amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and assembly, making it easier to work with this transistor in amplifier applications.

Surface Mount: YES

The surface mount capability allows for easy and compact placement on circuit boards, saving space and facilitating mass production.

Package Shape: ROUND

The round package shape provides easy handling and efficient heat dissipation, ensuring optimal performance in amplifier applications.

Terminal Form: FLAT

The flat terminal form allows for secure connections and easy soldering onto circuit boards, enhancing the reliability of the transistor.

Highest Frequency Band: HIGH FREQUENCY BAND

The high frequency band capability makes this transistor suitable for high-speed and high-frequency amplifier applications, delivering excellent performance.

No. of Terminals: 4

Having 4 terminals allows for versatile connection options and flexibility in circuit design, making this transistor adaptable to various amplifier configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and easy mounting on heat sinks or other components, enhancing the thermal management of the transistor.

Maximum Operating Temperature: 200 °C

The high maximum operating temperature of 200 °C ensures reliable performance even under demanding conditions, making this transistor suitable for a wide range of applications.

Maximum Collector-Base Capacitance: 360 pF

The low collector-base capacitance of 360 pF minimizes signal distortion and improves the overall performance of the amplifier circuit.

Maximum Collector-Emitter Voltage: 55 V

The high maximum collector-emitter voltage of 55 volts allows for use in a wide range of amplifier circuits, offering versatility and compatibility.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and efficiency in electronic devices, ensuring the high performance and durability of this transistor.

Maximum Collector Current (IC): 40 A

With a maximum collector current of 40 amps, this transistor can handle high power levels, making it suitable for demanding amplifier applications where high current is required.

Terminal Position: RADIAL

The radial terminal position allows for easy connections and layout in circuit designs, ensuring efficient signal flow and reliable operation in amplifier applications.

Technical Specifications

RF Power Bipolar Junction Transistors (BJT) SD1728F attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

360 pF

Maximum Collector-Emitter Voltage:

55 V

Configuration:

Highest Frequency Band:

HIGH FREQUENCY BAND

JESD-30 Code:

O-PRFM-F4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD1728F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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