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SD1732(TDS595)

STMicroelectronics

SD1732(TDS595) by STMicroelectronics

The SD1732 (TDS595) by STMicroelectronics is an NPN RF power BJT designed for amplifier applications. It features a max collector current of 2.6 A, operates up to 200 °C, and supports ultra-high frequency bands. Its flat terminal design allows for easy surface mounting in compact setups.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,538 parts In-Stock

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3,538

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Anansix

USA . 1,501 parts In-Stock

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1,501

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Vyrian

USA . 176 parts In-Stock

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176

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,506 parts In-Stock

1+ parts

$1.396

100+ parts

-

1k+ parts

$1.256

10k+ parts

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1,506

$1.396

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$1.256

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MKK Technologies

India . 1,008 parts In-Stock

1+ parts

$2.624

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1,008

$2.624

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DigiPath Technology Company

USA . 1,008 parts In-Stock

1+ parts

$2.624

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1,008

$2.624

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Corphita

USA . 1,763 parts In-Stock

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1,763

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Parana Technologies

USA . 494 parts In-Stock

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$1.669

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494

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$1.669

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Overview

Elevate your design with the SD1732(TDS595) from STMicroelectronics, a leader in innovative semiconductor solutions. This RF Power Bipolar Junction Transistor delivers exceptional performance and reliability, ideal for ultra-high frequency amplifier applications. Enjoy enhanced efficiency and reduced power loss, transforming your projects into high-quality, robust systems. Trust in STMicroelectronics’ legacy of excellence and unlock the full potential of your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the transistor lightweight and cost-effective while ensuring durability and resistance to environmental factors.

Polarity or Channel Type: NPN

NPN transistors are widely used for amplification and switching applications, making this transistor versatile in various electronic circuits.

Configuration: COMMON EMITTER, 2 ELEMENTS

The common emitter configuration is known for providing significant voltage gain, making it suitable for amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor is ideal for audio or radio frequency applications, ensuring high performance in signal processing.

Surface Mount: YES

The surface mount capability allows for compact circuit design, improving integration and reducing the overall footprint of electronic devices.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCBs, facilitating easier assembly and improved layout options.

Terminal Form: FLAT

Flat terminal form enhances soldering reliability and ensures good electrical contact, essential for high-frequency applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This transistor's capability to operate in the ultra-high frequency band makes it suitable for advanced communication systems and RF applications.

No. of Elements: 2

Having two elements allows for increased functionality and redundancy in circuit designs, enabling complex designs with better performance.

No. of Terminals: 4

The four-terminal design supports versatile circuit connections, improving flexibility in application across various platforms.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures stable mounting on PCBs, which is crucial for maintaining performance during mechanical stress.

Maximum Operating Temperature: 200 °C

High maximum operating temperature makes this transistor reliable in demanding environments, increasing its durability and application range.

Maximum Collector-Base Capacitance: 20 pF

Low collector-base capacitance helps maintain high speed and performance in RF applications, ensuring quick response times in signal processing.

Maximum Collector-Emitter Voltage: 18 V

With a maximum collector-emitter voltage of 18V, this transistor is suitable for low to moderate voltage applications, ensuring safety and reliability.

Transistor Element Material: SILICON

Silicon is a well-established material for transistors, providing excellent thermal stability and performance characteristics.

Maximum Collector Current (IC): 2.6 A

A maximum collector current rating of 2.6 A allows for substantial signal driving capability, making it suitable for various high-power applications.

Terminal Position: DUAL

Dual terminal position supports better layout flexibility and ease of integration in multi-transistor configurations.

Case Connection: EMITTER

Emphasizing emitter connection enhances amplification performance while simplifying circuit designs.

Technical Specifications

RF Power Bipolar Junction Transistors (BJT) SD1732(TDS595) attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Additional Features:

WITH EMITTER BALLASTING RESISTORS

Case Connection:

EMITTER

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

20 pF

Maximum Collector-Emitter Voltage:

18 V

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

2

No. of Terminals:

4

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD1732(TDS595) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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