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PD57070S

STMicroelectronics

PD57070S by STMicroelectronics

PD57070S by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact device ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,783 parts In-Stock

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5,783

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Anansix

USA . 701 parts In-Stock

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701

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Digiode

USA . 496 parts In-Stock

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496

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 303 parts In-Stock

1+ parts

$0.628

100+ parts

-

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$0.566

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303

$0.628

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$0.566

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MKK Technologies

India . 788 parts In-Stock

1+ parts

$1.182

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788

$1.182

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DigiPath Technology Company

USA . 788 parts In-Stock

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$1.182

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788

$1.182

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AZTECH Wire

Italy . 500 parts In-Stock

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$17.170

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500

$17.170

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Corphita

USA . 2,771 parts In-Stock

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2,771

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Parana Technologies

USA . 1,231 parts In-Stock

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$0.751

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$0.751

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Overview

Unlock superior performance with the PD57070S from STMicroelectronics, a leader in innovation and reliability. This N-channel RF Power FET enhances your amplification needs, delivering exceptional power efficiency and thermal management in compact applications. With its robust design tailored for ultra-high frequency operations, you can trust its durability and consistency to elevate your projects, ensuring a competitive edge in any market. Experience unmatched quality and versatility today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the transistor lightweight and suitable for various electronic applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher efficiency for high-speed applications, making this a solid choice for amplifiers.

Configuration: SINGLE

A single configuration allows for straightforward integration into circuits, minimizing complexity.

Transistor Application: AMPLIFIER

Designed for amplification, this FET ensures high integrity of signal transmission and performance.

Surface Mount: YES

Surface-mount technology allows for compact designs and reduced space requirements on PCBs.

Minimum DS Breakdown Voltage: 65 V

With a minimum breakdown voltage of 65V, this FET is robust enough for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape is efficient for mounting and handling, fitting into various circuit designs.

Terminal Form: FLAT

Flat terminal forms provide better contact with PCB surfaces, ensuring reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for improved performance characteristics and reduced power consumption.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of UHF operation, it is suitable for applications involving communication and signal processing.

Maximum Drain Current (Abs) (ID): 7 A

A maximum drain current of 7A makes it versatile for a range of power amplification needs.

No. of Terminals: 2

Two terminals simplify the design and integration in minimalistic circuit layouts.

Maximum Power Dissipation (Abs): 95 W

A high power dissipation rating ensures it can handle significant heat, increasing reliability in demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space and is suitable for modern compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides excellent scalability and performance, ideal for advanced applications.

Maximum Operating Temperature: 165 °C

Operating at high temperatures of up to 165 °C indicates durability and reliability in extreme environments.

Transistor Element Material: SILICON

Silicon is a widely used material for reliability and cost-effectiveness in semiconductor applications.

Terminal Finish: TIN LEAD

Tin-lead finish improves solderability, ensuring robust and lasting connections on PCBs.

Maximum Drain Current (ID): 7 A

Consistent current handling capability allows for versatile applications, reinforcing its effectiveness in power applications.

Terminal Position: DUAL

Dual terminal positions enhance flexibility in circuit layouts, improving design adaptability.

Case Connection: SOURCE

Direct source connection facilitates efficient circuit design and improved signal integrity.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57070S attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57070S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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