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STAP85050

STMicroelectronics

STAP85050 by STMicroelectronics

STAP85050 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 16 A, a breakdown voltage of 40 V, and operates in the ultra-high frequency band. Its compact flange mount design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,920 parts In-Stock

1+ parts

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1,920

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Vyrian

USA . 1,209 parts In-Stock

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1,209

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Anansix

USA . 949 parts In-Stock

1+ parts

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949

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,964 parts In-Stock

1+ parts

$0.535

100+ parts

-

1k+ parts

$0.482

10k+ parts

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1,964

$0.535

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$0.482

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MKK Technologies

India . 1,712 parts In-Stock

1+ parts

$1.007

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1,712

$1.007

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DigiPath Technology Company

USA . 1,712 parts In-Stock

1+ parts

$1.007

100+ parts

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1,712

$1.007

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Parana Technologies

USA . 2,212 parts In-Stock

1+ parts

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100+ parts

$0.640

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2,212

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$0.640

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Corphita

USA . 654 parts In-Stock

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654

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Overview

Unlock unparalleled performance with the STAP85050 from STMicroelectronics, a leader in innovative semiconductor technology. This N-channel RF Power FET is designed for efficiency and reliability, making it ideal for ultra-high frequency amplifiers in diverse applications—from telecommunications to automotive systems. With superior power handling and thermal stability, you can trust this robust solution to enhance your designs and drive exceptional results. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent reliability and protection in various environments, making the FET suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher efficiency and better performance in amplification applications, ensuring optimal operation.

Configuration: SINGLE

A single configuration simplifies circuit design and integration, making it ideal for streamlined applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET excels in audio and signal processing applications.

Surface Mount: YES

Surface mount technology saves space on PCBs and allows for automated assembly, improving production efficiency.

Minimum DS Breakdown Voltage: 40 V

A breakdown voltage of 40V provides robustness against voltage spikes, contributing to the reliability of the circuit.

Package Shape: RECTANGULAR

The rectangular package shape is conducive for easier placement in compact electronic layouts.

Terminal Form: FLAT

Flat terminals facilitate better thermal contact and electrical connections, enhancing overall performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption at idle and high efficiency during operation.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This FET's capabilities in the ultra-high frequency band make it suitable for telecommunication and RF applications.

Maximum Drain Current (Abs): 16 A

Handling up to 16 A of current allows for flexibility in high-power applications, making it a versatile choice.

No. of Terminals: 4

Four terminals provide multiple connection options, enabling efficient circuit design and implementation.

Maximum Power Dissipation (Abs): 158 W

High power dissipation capacity ensures reliability at higher power levels, preventing overheating during operation.

Package Style (Meter): FLANGE MOUNT

Flange mounting offers enhanced mechanical stability and thermal dissipation, ideal for demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching speeds, making this FET suitable for various applications.

Maximum Operating Temperature: 165 °C

A maximum operating temperature of 165 °C ensures performance stability in high-temperature conditions.

Transistor Element Material: SILICON

Silicon as the element material ensures good conductivity and performance reliability, making this FET a solid choice.

Maximum Drain Current (ID): 16 A

Allows for versatile use in various applications while handling demands without compromising performance.

Terminal Position: DUAL

Dual terminal positioning aids in flexible circuit designs, accommodating different layouts and configurations.

Case Connection: SOURCE

Source case connection allows for effective circuit integration and simplifies design considerations.

Technical Specifications

RF Power Field Effect Transistors (FET) STAP85050 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ESD PROTECTION

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

STAP85050 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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