Loading...

LET9045F

STMicroelectronics

LET9045F by STMicroelectronics

LET9045F by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 9 A, breakdown voltage of 80 V, and operates in the ultra-high frequency band. Its flatpack design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,918

-

-

-

-

Digiode

USA . 3,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,261

-

-

-

-

Anansix

USA . 1,724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,724

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,438 parts In-Stock

1+ parts

$1.518

100+ parts

-

1k+ parts

$1.366

10k+ parts

-

1,438

$1.518

-

$1.366

-

MKK Technologies

India . 879 parts In-Stock

1+ parts

$2.854

100+ parts

-

1k+ parts

-

10k+ parts

-

879

$2.854

-

-

-

DigiPath Technology Company

USA . 879 parts In-Stock

1+ parts

$2.854

100+ parts

-

1k+ parts

-

10k+ parts

-

879

$2.854

-

-

-

AZTECH Wire

Italy . 1,168 parts In-Stock

1+ parts

$8.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,168

$8.340

-

-

-

Ampacity Inc.

Singapore . 613 parts In-Stock

1+ parts

$30.050

100+ parts

-

1k+ parts

-

10k+ parts

-

613

$30.050

-

-

-

Parana Technologies

USA . 1,116 parts In-Stock

1+ parts

-

100+ parts

$1.815

1k+ parts

-

10k+ parts

-

1,116

-

$1.815

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Perfect Parts

USA . 176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

176

-

-

-

-

Corphita

USA . 146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

146

-

-

-

-

Overview

Unlock unparalleled performance with the LET9045F from STMicroelectronics, a trusted leader in innovation. This N-channel RF Power FET delivers exceptional efficiency and reliability for your amplifier applications, even in ultra-high frequency ranges. Its robust design ensures maximum power dissipation, making it ideal for demanding environments. Choose LET9045F to elevate your projects with cutting-edge technology that guarantees quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the product suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility and efficiency, making them ideal for high-speed applications.

Configuration: SINGLE

A single configuration simplifies the design and minimizes the space required on a circuit board, allowing for easier integration.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, this FET ensures optimal performance in signal processing applications.

Surface Mount: YES

Surface mount capability allows for efficient space utilization and automated assembly, enhancing production efficiency.

Minimum DS Breakdown Voltage: 80 V

An 80V breakdown voltage rating provides robust protection against high voltage surges, ensuring reliability in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for layout flexibility on circuit boards, enabling efficient coupling and heat dissipation.

Terminal Form: FLAT

Flat terminals facilitate better electrical contact and easier soldering, promoting reliability in connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation helps in achieving lower power consumption during idle states, enhancing overall system efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra high frequency band, making it suitable for high-speed RF applications and communication systems.

Maximum Drain Current (Abs) (ID): 9 A

A maximum drain current of 9 A allows it to handle significant power loads, ideal for high power amplification tasks.

No. of Terminals: 2

With only two terminals, this FET simplifies the connection setup and minimizes potential points of failure.

Maximum Power Dissipation (Abs): 108 W

A power dissipation capability of 108 W ensures that the device can manage high power levels without overheating, enhancing durability.

Package Style (Meter): FLATPACK

The flatpack style enables compact placement within electronic devices, optimizing space and potentially reducing production costs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high switching speeds and low power consumption, making this FET suitable for modern electronic applications.

Maximum Operating Temperature: 200 °C

A maximum operating temperature of 200 °C ensures reliability in extreme conditions, suitable for high-temperature applications.

Transistor Element Material: SILICON

The use of silicon enhances the thermal stability and overall performance of the FET, ensuring long service life.

Maximum Drain Current (ID): 9 A

This specification reiterates the high current capability of the FET, allowing it to perform effectively in high-demand environments.

Terminal Position: DUAL

Dual terminal positioning provides flexible circuit design options and improves connectivity with other components.

Case Connection: SOURCE

The source case connection ensures efficient power management and minimizes loss, enhancing overall circuit performance.

Technical Specifications

RF Power Field Effect Transistors (FET) LET9045F attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFP-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET9045F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19