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VRF157FL

Microchip Technology

VRF157FL by Microchip Technology

VRF157FL by Microchip is a N-CHANNEL RF Power FET with 170V DS Breakdown Voltage, suitable for amplifier applications in the VHF band. It features a max drain current of 60A, operates in enhancement mode, and has a very high frequency band. The package style is flange mount with ceramic-metal sealed co-fired body material.

Median Price

$466.840

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 34 parts In-Stock

1+ parts

$466.840

100+ parts

$395.020

1k+ parts

$356.550

10k+ parts

$341.170

34

$466.840

$395.020

$356.550

$341.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 27 parts In-Stock

1+ parts

$366.440

100+ parts

$337.510

1k+ parts

$312.820

10k+ parts

-

27

$366.440

$337.510

$312.820

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

NexGen Digital

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 182 parts In-Stock

1+ parts

$0.387

100+ parts

-

1k+ parts

-

10k+ parts

-

182

$0.387

-

-

-

Ampacity Inc.

Singapore . 654 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

654

$3.050

-

-

-

Microchip USA

USA . 2,192 parts In-Stock

1+ parts

$700.262

100+ parts

-

1k+ parts

-

10k+ parts

-

2,192

$700.262

-

-

-

Marpe Global Electronics

Taiwan . 5,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,680

-

-

-

-

QualityLine Systems

Poland . 5,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,680

-

-

-

-

XL Components Corporation

Australia . 5,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,680

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

-

-

-

Overview

Upgrade your RF power amplifier designs with the VRF157FL from Microchip Technology. This N-CHANNEL FET offers a very high frequency band for enhanced performance in amplifier applications. With a maximum drain current of 60A and a minimum DS breakdown voltage of 170V, this single-configured transistor delivers top-notch reliability and efficiency. Its ceramic, metal-sealed co-fired package ensures durability while its dual terminal position allows for easy installation. Trust Microchip Technology to provide cutting-edge technology that exceeds expectations. Elevate your RF power designs with the VRF157FL today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for various applications in harsh environments.

Minimum DS Breakdown Voltage: 170 V

This high breakdown voltage allows for a higher level of electrical safety and protection against voltage spikes or surges.

Transistor Application: AMPLIFIER

Being designed for amplifier applications, this product can provide high gain and output power, making it ideal for RF amplification purposes.

Maximum Drain Current (ID): 60 A

With a high maximum drain current rating, this FET can handle high power levels, ensuring efficient performance in demanding applications.

Maximum Operating Temperature: 200 °C

The high maximum operating temperature allows for reliable operation in elevated temperature environments, improving overall product durability.

Technical Specifications

RF Power Field Effect Transistors (FET) VRF157FL attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

170 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

65 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F2

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

VRF157FL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.95

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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