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VRF157FLMP

Microchip Technology

VRF157FLMP by Microchip Technology

VRF157FLMP by Microchip is a N-CHANNEL RF Power FET with 170V DS Breakdown Voltage, suitable for amplifier applications in the VHF band. It features a max drain current of 60A, operating in enhancement mode at up to 200°C. The package style is flange mount with a metal-oxide semiconductor technology and dual terminal position.

Median Price

$933.680

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 132 parts In-Stock

1+ parts

$933.680

100+ parts

$790.030

1k+ parts

$713.080

10k+ parts

$682.310

132

$933.680

$790.030

$713.080

$682.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 106 parts In-Stock

1+ parts

$684.030

100+ parts

$641.270

1k+ parts

-

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106

$684.030

$641.270

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,272 parts In-Stock

1+ parts

$39.050

100+ parts

-

1k+ parts

-

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1,272

$39.050

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Microchip USA

USA . 5,352 parts In-Stock

1+ parts

$934.181

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5,352

$934.181

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Marpe Global Electronics

Taiwan . 8,162 parts In-Stock

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8,162

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QualityLine Systems

Poland . 8,162 parts In-Stock

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8,162

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XL Components Corporation

Australia . 8,162 parts In-Stock

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8,162

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Enhance your amplifier projects with the VRF157FLMP RF Power Field Effect Transistor by Microchip Technology. Crafted from high-quality materials and boasting a very high frequency band, this N-CHANNEL FET offers unmatched performance and reliability. Whether you're designing radio communication systems or radar applications, the VRF157FLMP delivers exceptional power and efficiency. Trust Microchip Technology to provide cutting-edge solutions for your electronic designs. Elevate your projects with the VRF157FLMP today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent thermal conductivity and durability, ensuring the RF Power FET can withstand high temperatures and demanding environments.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON-resistance and higher current carrying capability, making them efficient for amplification applications.

Configuration: SINGLE

A single configuration simplifies the circuit design and can lead to better performance and reliability.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, ensuring optimized performance in RF power amplifiers.

Minimum DS Breakdown Voltage: 170 V

Having a high breakdown voltage makes this RF FET suitable for high-power applications, providing robustness and reliability.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, making assembly and production more efficient.

Maximum Drain Current (ID): 60 A

With a high maximum drain current, this RF FET can handle large amounts of power, making it suitable for high-power RF amplification.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making it ideal for RF power amplification.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this RF FET can operate reliably in high-temperature environments without degradation in performance.

Maximum Feedback Capacitance (Crss): 65 pF

Low feedback capacitance ensures stability and consistent performance in various operating conditions, crucial for RF power amplifier applications.

Technical Specifications

RF Power Field Effect Transistors (FET) VRF157FLMP attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

170 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

65 pF

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

VRF157FLMP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.95

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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