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VRF151G

Microchip Technology

VRF151G by Microchip Technology

VRF151G by Microchip Technology is a N-CHANNEL RF Power FET with 170V DS Breakdown Voltage, 40A Max Drain Current, and 500W Max Power Dissipation. Commonly used in amplifier applications for Very High Frequency Band operations due to its ceramic-metal sealed co-fired package and dual terminal position.

Median Price

$174.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 120 parts In-Stock

1+ parts

$174.580

100+ parts

$147.730

1k+ parts

$133.340

10k+ parts

$127.580

120

$174.580

$147.730

$133.340

$127.580

DigiKey

USA . 22 parts In-Stock

1+ parts

$174.580

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-

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22

$174.580

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$133.340

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100

$133.340

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Vyrian

USA . 3,946 parts In-Stock

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3,946

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Legend Electronics Inc.

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.744

100+ parts

$0.737

1k+ parts

$0.707

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-

1,000

$0.744

$0.737

$0.707

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AZTECH Wire

Italy . 642 parts In-Stock

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$11.033

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642

$11.033

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Netroflash

USA . 2,000 parts In-Stock

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$133.340

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2,000

$133.340

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Continental Prestige Electronics

USA . 1,458 parts In-Stock

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$133.340

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$130.673

1,458

$133.340

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$130.673

Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$148.390

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3

$148.390

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Microchip USA

USA . 5,864 parts In-Stock

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$261.870

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$261.870

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West Coast Incorporated

USA . 6,921 parts In-Stock

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Argo Parts USA

USA . 3,091 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 66 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the VRF151G by Microchip Technology. As a leader in RF Power Field Effect Transistors (FET), Microchip ensures top-notch quality and reliability. The VRF151G is a game-changer in the amplifier industry, offering customers unparalleled performance and efficiency. Experience the benefits of its N-CHANNEL configuration, very high frequency band, and maximum power dissipation of 500W. Say goodbye to limitations and hello to endless possibilities with the VRF151G from Microchip Technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability to the product, ensuring it can withstand harsh environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for high-performance applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, this FET is optimized for providing high gain and low noise performance.

Minimum DS Breakdown Voltage: 170 V

With a high breakdown voltage, this FET can handle higher voltages without risk of damage, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 500 W

With a high power dissipation capability, this FET can handle large amounts of power without overheating, improving its overall reliability.

Maximum Operating Temperature: 200 °C

The ability to operate at high temperatures makes this FET suitable for applications where heat dissipation is a concern.

Technical Specifications

RF Power Field Effect Transistors (FET) VRF151G attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

170 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

36 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

VRF151G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.95

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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