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GS61008P-MR

Gan Systems

GS61008P-MR by Gan Systems

GS61008P-MR by Gan Systems is an N-CHANNEL FET for SWITCHING applications. It operates in ENHANCEMENT MODE with a 100V DS Breakdown Voltage and 90A ID. Utilizes GALLIUM NITRIDE technology, suitable for VERY HIGH FREQUENCY BAND operations.

Median Price

$7.910

Lifecycle Status

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Chip1Stop

Japan . 250 parts In-Stock

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$7.910

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$6.270

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$6.250

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$7.910

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$6.250

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Mouser Electronics

USA . 4,674 parts In-Stock

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$8.090

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$6.360

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$4.740

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$8.090

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DigiKey

USA . 160 parts In-Stock

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$9.340

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$5.895

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$4.895

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$9.340

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$4.895

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Verical

USA . 250 parts In-Stock

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$5.503

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$5.249

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Arrow

USA . 250 parts In-Stock

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$5.503

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$5.249

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$5.249

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Nova Conductors

Japan . 200 parts In-Stock

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$7.700

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Vyrian

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NexGen Digital

USA . 125 parts In-Stock

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Aztec Data Supply Inc.

USA . 366 parts In-Stock

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$0.690

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$0.690

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Continental Prestige Electronics

USA . 3,270 parts In-Stock

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$7.395

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$7.247

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Argo Parts USA

USA . 892 parts In-Stock

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Overview

Infineon Technologies GS6100x 100V E-HEMT Transistors are enhancement mode GaN-on-Silicon power devices. These transistors feature GaN properties that offer high current, voltage breakdown, and switching frequency. The GS6100x transistors use Island Technology® cell layout to provide a high-current die and high yield. The devices also feature GaNPX® packaging with low conductance and low thermal resistance in a small package. The GS6100x transistors provide very low junction-to-case thermal resistance for high-power applications. All these features are combined to offer very high-efficiency power switching.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good insulation and protection for the transistor, ensuring reliable performance and durability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, making them suitable for high-performance applications.

Configuration: SINGLE

Single configuration allows for simplified circuit design and integration, making this transistor easy to implement in various electronic systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and efficient performance.

Surface Mount: YES

Surface mount capability ensures easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this transistor can handle high voltage levels, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and efficient use of space on the PCB, contributing to a compact and streamlined design.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and allows for environmentally friendly disposal, meeting industry standards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers better control and efficiency in switching applications, enhancing the overall performance of the transistor.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Designed for very high frequency bands, this transistor is suitable for high-speed applications requiring reliable signal amplification and transmission.

No. of Terminals: 4

Four terminals provide flexible connectivity options and allow for versatile circuit configurations, enabling customization for specific requirements.

Package Style (Meter): CHIP CARRIER

Chip carrier package style ensures easy handling and installation, making this transistor suitable for automated assembly processes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and performance, ensuring stable operation under varying conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high temperatures, making it suitable for demanding industrial environments.

Transistor Element Material: GALLIUM NITRIDE

Gallium nitride material provides excellent electron mobility and power handling capabilities, enhancing the overall efficiency and performance of the transistor.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this transistor can operate in harsh cold environments, ensuring reliable performance in extreme conditions.

Terminal Finish: GOLD OVER NICKEL

Gold over nickel terminal finish offers superior conductivity and corrosion resistance, ensuring long-term reliability and consistent performance.

Maximum Drain Current (ID): 90 A

High maximum drain current rating of 90A allows for handling large currents, making this transistor suitable for power applications requiring high current levels.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on PCBs, ensuring secure connections and reliable performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture but can still be handled and stored in standard manufacturing environments.

Case Connection: SOURCE

Source case connection provides efficient grounding and heat dissipation, ensuring stable operation and preventing overheating in high-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time at peak reflow temperature of 30 seconds ensures safe and controlled soldering process, preventing damage to the transistor during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and bonding, ensuring secure connections and long-term stability in the final product.

Technical Specifications

RF Power Field Effect Transistors (FET) GS61008P-MR attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Gan Systems

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

90 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PBCC-N4

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

GALLIUM NITRIDE

Trade Compliance

GS61008P-MR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Gan Systems

We live in a data and energy driven world increasingly defined by power-reliant industries including data centers, electric vehicles, renewable energy systems, industrial motors, and consumer electronics. These businesses have long faced formidable and universal challenges around energy wasted in power conversion, as well as the size limitations placed on overall product design by the old generation ecosystem of power system components. Yesterday’s silicon has reached its limits. GaN technology is the clear and undisputed solution for today and tomorrow. GaN Systems’ approach to a new generation of GaN power transistors is leading an industry-changing shift in both the short-term and ‘near future’ relationship between technology’s power systems and energy–creating significant product and system-wide changes. Design engineers are building power systems that are: · one-quarter the power loss · one-quarter the size · one-quarter the weight · and less expensive than silicon-based solutions For corporate leaders, GaN not only changes their company’s immediate relationship with power; it can alter the competitive trajectory of the entire business through the creation of whole new classes of products, systems, and sustainability initiatives.

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