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PD54008TR-E

STMicroelectronics

PD54008TR-E by STMicroelectronics

PD54008TR-E by STMicroelectronics is an N-CHANNEL RF Power FET with 25V DS Breakdown Voltage, ideal for AMPLIFIER applications. It operates in ENHANCEMENT MODE at ULTRA HIGH FREQUENCY BAND, with a max ID of 5A and 73W power dissipation. The transistor features GULL WING terminals, METAL-OXIDE SEMICONDUCTOR technology, and can withstand temperatures up to 165°C.

Median Price

$10.571

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 67 parts In-Stock

1+ parts

$10.571

100+ parts

-

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67

$10.571

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Vyrian

USA . 3,939 parts In-Stock

1+ parts

-

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3,939

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Chip Stock

USA . 2,580 parts In-Stock

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2,580

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Anansix

USA . 720 parts In-Stock

1+ parts

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720

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Digiode

USA . 54 parts In-Stock

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54

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 528 parts In-Stock

1+ parts

$0.772

100+ parts

-

1k+ parts

$0.695

10k+ parts

-

528

$0.772

-

$0.695

-

MKK Technologies

India . 1,011 parts In-Stock

1+ parts

$1.451

100+ parts

-

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1,011

$1.451

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DigiPath Technology Company

USA . 1,011 parts In-Stock

1+ parts

$1.451

100+ parts

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1,011

$1.451

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Aztec Data Supply Inc.

USA . 261 parts In-Stock

1+ parts

$1.640

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261

$1.640

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Corohmni

South Africa . 60 parts In-Stock

1+ parts

$1.997

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60

$1.997

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Ampacity Inc.

Singapore . 402 parts In-Stock

1+ parts

$7.050

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402

$7.050

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Continental Prestige Electronics

USA . 1,187 parts In-Stock

1+ parts

$10.571

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$10.359

1,187

$10.571

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$10.359

AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$14.593

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798

$14.593

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Microchip USA

USA . 7,268 parts In-Stock

1+ parts

$29.476

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7,268

$29.476

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Semicontronic

India . 835 parts In-Stock

1+ parts

$35.050

100+ parts

$34.174

1k+ parts

$33.998

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835

$35.050

$34.174

$33.998

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 4,872 parts In-Stock

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4,872

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Argo Parts USA

USA . 1,834 parts In-Stock

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1,834

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$10.359

1k+ parts

$10.042

10k+ parts

$9.831

500

-

$10.359

$10.042

$9.831

Parana Technologies

USA . 285 parts In-Stock

1+ parts

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100+ parts

$0.923

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285

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$0.923

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Overview

Unlock the full potential of your RF applications with the PD54008TR-E by STMicroelectronics. Built with precision and expertise, this N-CHANNEL RF Power Field Effect Transistor boasts ultra-high frequency performance and a maximum power dissipation of 73W. Ideal for amplifier configurations, this enhancement mode transistor offers reliable and efficient operation, making it a valuable asset for your projects. Experience superior quality and unmatched performance with the PD54008TR-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and helps in maintaining the overall durability of the product.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer better performance compared to P-Channel FETs, making this product a good choice for various applications.

Configuration: SINGLE

Simplifies the design and allows for easy integration into different circuit configurations.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, ensuring optimal performance in amplification circuits.

Surface Mount: YES

Enables easy and efficient mounting on PCBs, saving space and facilitating automated assembly.

Maximum Drain Current (Abs) (ID): 5 A

The high maximum drain current allows for handling higher power levels, making this FET suitable for power amplifier applications.

Maximum Power Dissipation (Abs): 73 W

With a high maximum power dissipation, this FET can handle significant power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high input impedance and fast switching speeds, making it ideal for various applications requiring high performance.

Maximum Operating Temperature: 165 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54008TR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54008TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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