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PD54003TR-E

STMicroelectronics

PD54003TR-E by STMicroelectronics

PD54003TR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This compact surface-mount transistor ensures efficient performance up to 165 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,557 parts In-Stock

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4,557

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Digiode

USA . 4,023 parts In-Stock

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4,023

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Anansix

USA . 2,094 parts In-Stock

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2,094

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 568 parts In-Stock

1+ parts

$1.378

100+ parts

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$1.240

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568

$1.378

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$1.240

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MKK Technologies

India . 1,579 parts In-Stock

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$2.592

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1,579

$2.592

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DigiPath Technology Company

USA . 1,579 parts In-Stock

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$2.592

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1,579

$2.592

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Corphita

USA . 4,005 parts In-Stock

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4,005

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Parana Technologies

USA . 577 parts In-Stock

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$1.648

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577

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$1.648

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Overview

Elevate your designs with the PD54003TR-E from STMicroelectronics, a leader in semiconductor innovation. This N-channel RF Power FET is engineered for superior performance, making it ideal for amplifiers in ultra-high frequency applications. With its robust construction and efficient power handling, you can trust its reliability and build quality. Choose STMicroelectronics for unmatched value and advancements that empower your projects to soar.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers good thermal and mechanical stability, ensuring reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically provide higher efficiency and better performance in applications such as amplifiers, making this FET a suitable choice for RF applications.

Configuration: SINGLE

A single configuration helps in simplifying the circuit design and reduces the overall footprint, which is advantageous for compact devices.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is ideal for RF applications that require signal boosting, enhancing performance in communication devices.

Surface Mount: YES

Surface mount capability allows for automated assembly and a smaller PCB design, which is essential for modern electronic devices.

Minimum DS Breakdown Voltage: 25 V

A minimum drain-source breakdown voltage of 25 V ensures safety and reliability under high voltage conditions, making it suitable for various RF applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of space on PCBs and allows for straightforward integration into existing designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide good mechanical strength, enhancing the reliability of the connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of current flow, making this FET more efficient in amplifying signals.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band makes this FET suitable for high-speed applications, crucial for modern RF communication systems.

Maximum Drain Current (Abs) (ID): 4 A

The capability to handle a maximum drain current of 4 A allows this FET to drive heavier loads, making it ideal for high-performance amplifiers.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit configuration, making it easier to integrate into designs that require minimal components.

Maximum Power Dissipation (Abs): 52.8 W

Being able to dissipate up to 52.8 W of power ensures that the transistor can handle substantial energy without overheating, enhancing reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards, which is crucial for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and fast switching capabilities, making this FET highly efficient for RF signal processing.

Maximum Operating Temperature: 165 °C

A maximum operating temperature of 165 °C ensures that the FET can operate in harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon material provides excellent thermal and electrical performance, which is critical for consistent operation in RF applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance, contributing to the longevity of the component.

Maximum Drain Current (ID): 4 A

Repeated for emphasis, the ability to handle a maximum drain current of 4 A is a key feature for ensuring robust performance in demanding applications.

Terminal Position: DUAL

Having a dual terminal position allows for greater flexibility in PCB layout and design, aiding in effective space utilization.

Case Connection: SOURCE

The source connection at the case provides a straightforward interface for connections, simplifying circuit integration.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54003TR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54003TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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