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PD54008-E

STMicroelectronics

PD54008-E by STMicroelectronics

STMicroelectronics PD54008-E is an N-CHANNEL RF Power FET with 25V DS Breakdown Voltage. It operates in ULTRA HIGH FREQUENCY BAND, suitable for AMPLIFIER applications. With 5A Drain Current and 73W Power Dissipation, it's ideal for high-power amplification needs.

Median Price

$15.260

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,546 parts In-Stock

1+ parts

$15.260

100+ parts

$10.030

1k+ parts

-

10k+ parts

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1,546

$15.260

$10.030

-

-

DigiKey

USA . 398 parts In-Stock

1+ parts

$15.260

100+ parts

$10.399

1k+ parts

$9.523

10k+ parts

-

398

$15.260

$10.399

$9.523

-

Avnet

USA . 400 parts In-Stock

1+ parts

-

100+ parts

-

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400

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$10.370

100+ parts

-

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100

$10.370

-

-

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Digiode

USA . 3,900 parts In-Stock

1+ parts

$14.146

100+ parts

-

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3,900

$14.146

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Chip Stock

USA . 2,580 parts In-Stock

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2,580

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Anansix

USA . 901 parts In-Stock

1+ parts

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901

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Vyrian

USA . 786 parts In-Stock

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786

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,102 parts In-Stock

1+ parts

$0.618

100+ parts

-

1k+ parts

$0.556

10k+ parts

-

1,102

$0.618

-

$0.556

-

MKK Technologies

India . 1,357 parts In-Stock

1+ parts

$1.163

100+ parts

-

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1,357

$1.163

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DigiPath Technology Company

USA . 1,357 parts In-Stock

1+ parts

$1.163

100+ parts

-

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1,357

$1.163

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Corohmni

South Africa . 122 parts In-Stock

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$1.358

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122

$1.358

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$10.370

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2,000

$10.370

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Ampacity Inc.

Singapore . 758 parts In-Stock

1+ parts

$12.660

100+ parts

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758

$12.660

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Corphita

USA . 4,757 parts In-Stock

1+ parts

$13.401

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4,757

$13.401

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Microchip USA

USA . 6,097 parts In-Stock

1+ parts

$41.272

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6,097

$41.272

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Component Stockers USA

USA . 170 parts In-Stock

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$158.350

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170

$158.350

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iodParts Technologies Inc.

India . 5,250 parts In-Stock

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5,250

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Argo Parts USA

USA . 5,165 parts In-Stock

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5,165

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Parana Technologies

USA . 1,875 parts In-Stock

1+ parts

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100+ parts

$0.739

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1,875

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$0.739

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Perfect Parts

USA . 890 parts In-Stock

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890

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Continental Prestige Electronics

USA . 378 parts In-Stock

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378

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Overview

Unleash the power of cutting-edge technology with the PD54008-E by STMicroelectronics, a top-tier manufacturer known for delivering unparalleled quality and reliability. As a leading RF Power Field Effect Transistor in its category, this product offers customers exceptional value and benefits. With applications in amplifiers and operating in the ultra-high frequency band, this single-channel transistor is designed for enhanced performance and efficiency. Elevate your projects with the PD54008-E and experience the advantages of superior design and functionality that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of current, enhancing the overall performance of the transistor.

Configuration: SINGLE

Simplifies circuit design and implementation, ideal for applications requiring a single channel transistor.

Transistor Application: AMPLIFIER

Designed for amplification of signals, ensuring accurate and clear output.

Surface Mount: YES

Enables easy and convenient mounting on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 25 V

Ensures reliable operation under varying voltage conditions, enhancing the overall stability of the transistor.

Package Shape: RECTANGULAR

Facilitates organized and compact arrangement on circuit boards, optimizing space utilization.

Terminal Form: GULL WING

Allows for secure and efficient soldering, ensuring reliable connections in electronic circuits.

Operating Mode: ENHANCEMENT MODE

Offers flexibility in controlling the transistor's conductivity, enabling precise modulation of signal amplification.

Max Drain Current: 5 A

Capable of handling high current loads, making it suitable for power amplification applications.

Max Power Dissipation: 73 W

Provides sufficient power handling capacity for demanding applications, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and reliability, making the transistor suitable for critical applications.

Max Operating Temperature: 165 °C

Can operate in high-temperature environments, expanding the range of applications where the transistor can be used.

Transistor Element Material: SILICON

Silicon is known for its excellent semiconductor properties, contributing to the transistor's overall performance and reliability.

Terminal Finish: MATTE TIN

Provides corrosion resistance and ensures reliable electrical connections, enhancing the durability of the transistor.

Terminal Position: DUAL

Allows for flexible circuit configurations, supporting various circuit designs and applications.

Case Connection: SOURCE

Enables easy connection to external circuits, simplifying the integration of the transistor into electronic systems.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54008-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54008-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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