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PD54003STR-E

STMicroelectronics

PD54003STR-E by STMicroelectronics

PD54003STR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This compact surface mount transistor ensures efficient performance up to 165 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,551 parts In-Stock

1+ parts

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3,551

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Anansix

USA . 2,065 parts In-Stock

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2,065

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Digiode

USA . 531 parts In-Stock

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531

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 261 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

$0.855

10k+ parts

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261

$0.950

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$0.855

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MKK Technologies

India . 1,281 parts In-Stock

1+ parts

$1.787

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1,281

$1.787

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DigiPath Technology Company

USA . 1,281 parts In-Stock

1+ parts

$1.787

100+ parts

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1,281

$1.787

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Corphita

USA . 1,196 parts In-Stock

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1,196

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Parana Technologies

USA . 506 parts In-Stock

1+ parts

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100+ parts

$1.136

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506

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$1.136

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Overview

Unlock unparalleled performance with the PD54003STR-E from STMicroelectronics—your go-to solution for RF power applications. Renowned for their exceptional quality and reliability, STMicroelectronics ensures that this N-channel FET delivers superior amplification in ultra-high frequency environments. With a compact design and robust capabilities, it empowers your projects with efficiency and durability, making it ideal for advanced communication systems, amplifiers, and more. Elevate your technology with trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and protection against environmental factors, making it suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide lower on-resistance and higher electron mobility, enhancing overall performance in amplification applications.

Configuration: SINGLE

A single configuration simplifies circuit design and keeps costs down while maintaining effective performance.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is ideal for audio and RF amplification in various electronic devices.

Surface Mount: YES

Surface mount technology allows for compact design, easy assembly, and improved reliability in manufacturing processes.

Minimum DS Breakdown Voltage: 25 V

The 25V rating ensures reliable operation in high-voltage applications, providing flexibility for various circuits.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of PCB space and allows for better thermal management.

Terminal Form: FLAT

Flat terminals simplify soldering and contribute to a more efficient heat dissipation, enhancing the device's reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption when the transistor is off, improving energy efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This transistor's capability to operate in the UHF band makes it suitable for high-frequency applications, such as communication devices.

Maximum Drain Current (Abs) (ID): 4 A

A maximum drain current of 4A allows the FET to handle significant loads, making it a reliable choice for various demanding applications.

No. of Terminals: 2

Having just two terminals simplifies connections and minimizes the complexity of circuit design.

Maximum Power Dissipation (Abs): 52.8 W

The high maximum power dissipation level ensures the device can handle substantial power without overheating, enhancing reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs and supports modern compact electronic device trends.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology improves performance and efficiency, making it a widely preferred choice for today's electronics.

Maximum Operating Temperature: 165 °C

The high operating temperature tolerance allows for use in a wider range of environments and applications without performance degradation.

Transistor Element Material: SILICON

Silicon is a reliable semiconductor material known for its good electrical properties, aiding stability and performance in various applications.

Maximum Drain Current (ID): 4 A

Reiterating the maximum drain current capability for consistency, making it suitable for high load applications.

Terminal Position: DUAL

Dual terminal position provides versatility in PCB layouts, allowing for better optimization in design.

Case Connection: SOURCE

Direct source connection aids in straightforward circuit designs and simplifies integration into larger systems.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54003STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54003STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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