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SD4933

STMicroelectronics

SD4933 by STMicroelectronics

SD4933 by STMicroelectronics is an N-channel RF power FET designed for ultra-high frequency applications. It features a max drain current of 40 A, a breakdown voltage of 200 V, and can dissipate up to 648 W. Ideal for high-performance RF amplification in compact designs.

Median Price

$126.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 63 parts In-Stock

1+ parts

$126.050

100+ parts

$108.900

1k+ parts

-

10k+ parts

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63

$126.050

$108.900

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,035 parts In-Stock

1+ parts

$123.718

100+ parts

-

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2,035

$123.718

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Chip Stock

USA . 5,940 parts In-Stock

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5,940

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Vyrian

USA . 2,129 parts In-Stock

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2,129

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Anansix

USA . 402 parts In-Stock

1+ parts

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402

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 919 parts In-Stock

1+ parts

$0.598

100+ parts

-

1k+ parts

$0.538

10k+ parts

-

919

$0.598

-

$0.538

-

MKK Technologies

India . 490 parts In-Stock

1+ parts

$1.124

100+ parts

-

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490

$1.124

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DigiPath Technology Company

USA . 490 parts In-Stock

1+ parts

$1.124

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-

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490

$1.124

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Corphita

USA . 1,873 parts In-Stock

1+ parts

$117.207

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1,873

$117.207

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Microchip USA

USA . 4,145 parts In-Stock

1+ parts

$205.005

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4,145

$205.005

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

1+ parts

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5,880

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QUARKTWIN TECHNOLOGY LTD

USA . 4,012 parts In-Stock

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4,012

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Parana Technologies

USA . 703 parts In-Stock

1+ parts

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100+ parts

$0.715

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703

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$0.715

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Authorized Procurement Solutions

USA . 150 parts In-Stock

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150

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Perfect Parts

USA . 27 parts In-Stock

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27

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Overview

Experience unparalleled performance with the SD4933 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust RF power FET is designed for ultra-high frequency applications, offering reliability and efficiency that professionals trust. With its exceptional power dissipation capabilities and compact design, it enhances system performance while saving space. Elevate your projects with the quality and expertise that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package provides good mechanical protection and thermal stability, making this FET suitable for a variety of environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility, resulting in better performance and efficiency in amplifying signals.

Configuration: SINGLE

A single configuration allows for simpler circuit designs, making integration into various applications easier and more efficient.

Surface Mount: YES

Surface mount capability allows for compact designs and easy assembly in automated manufacturing processes, making it ideal for modern electronics.

Minimum DS Breakdown Voltage: 200 V

With a breakdown voltage of 200 V, this FET can handle high voltage applications reliably, ensuring reduced risk of failure in demanding environments.

Package Shape: ROUND

Round package shapes can be advantageous for heat dissipation, enhancing the reliability and performance of the component in applications.

Terminal Form: FLAT

Flat terminals are easier to solder and provide better contact for surface mount applications, ensuring reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides high input impedance and low power consumption, making this transistor suitable for battery-operated devices.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band, this FET is well-suited for RF and microwave applications, enhancing signal processing capabilities.

Maximum Drain Current (Abs) (ID): 40 A

A maximum drain current rating of 40 A allows for robust performance in high-power applications, accommodating a wide range of load requirements.

No. of Terminals: 4

Having 4 terminals facilitates versatile connections, allowing for more complex circuit designs and configurations.

Maximum Power Dissipation (Abs): 648 W

The high power dissipation capability of 648 W enables the FET to operate efficiently under heavy load conditions, ensuring reliability and longevity.

Package Style (Meter): FLANGE MOUNT

The flange mount style ensures a secure attachment to circuit boards, providing stability in high-vibration environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology results in a higher efficiency, faster switching speeds, and lower static power consumption, making this FET more advantageous for modern applications.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200 °C, this FET is ideal for high-temperature applications, ensuring consistent performance in extreme conditions.

Transistor Element Material: SILICON

Silicon is the most widely used semiconductor material, providing good performance, cost-effectiveness, and availability for extensive applications.

Maximum Drain Current (ID): 40 A

Reiterating the 40 A max drain current emphasizes its capacity for handling high power, making it suitable for demanding electronic applications.

Terminal Position: RADIAL

Radial terminal positions provide flexible mounting options, suitable for various circuit layouts and design preferences.

Case Connection: SOURCE

Connecting the case to the source allows for improved heat management and better reliability in circuit operation.

Technical Specifications

RF Power Field Effect Transistors (FET) SD4933 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

O-PRFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

RADIAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

SD4933 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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