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PD57018TR-E

STMicroelectronics

PD57018TR-E by STMicroelectronics

PD57018TR-E by STMicroelectronics is an N-channel RF FET designed for amplifier applications, featuring a max drain current of 2.5 A and a breakdown voltage of 65 V. It operates in the ultra-high frequency band with a power dissipation of 31.7 W. This surface-mount transistor ensures reliable performance up to 165 °C.

Median Price

$31.940

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 387 parts In-Stock

1+ parts

$31.940

100+ parts

$24.067

1k+ parts

$21.304

10k+ parts

-

387

$31.940

$24.067

$21.304

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,211 parts In-Stock

1+ parts

$29.127

100+ parts

-

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1,211

$29.127

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Vyrian

USA . 4,943 parts In-Stock

1+ parts

-

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4,943

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Anansix

USA . 2,807 parts In-Stock

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2,807

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Semi Source

USA . 55 parts In-Stock

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-

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55

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,206 parts In-Stock

1+ parts

$1.663

100+ parts

-

1k+ parts

$1.497

10k+ parts

-

2,206

$1.663

-

$1.497

-

MKK Technologies

India . 318 parts In-Stock

1+ parts

$3.128

100+ parts

-

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318

$3.128

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DigiPath Technology Company

USA . 318 parts In-Stock

1+ parts

$3.128

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-

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318

$3.128

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-

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Corphita

USA . 313 parts In-Stock

1+ parts

$27.594

100+ parts

-

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-

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313

$27.594

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-

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Microchip USA

USA . 412 parts In-Stock

1+ parts

$54.268

100+ parts

-

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412

$54.268

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 2,400 parts In-Stock

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2,400

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iodParts Technologies Inc.

India . 2,302 parts In-Stock

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2,302

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Parana Technologies

USA . 1,800 parts In-Stock

1+ parts

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100+ parts

$1.989

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1,800

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$1.989

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GreenTree Electronics

Israel . 600 parts In-Stock

1+ parts

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600

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Perfect Parts

USA . 12 parts In-Stock

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12

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Overview

Unlock unparalleled performance with the PD57018TR-E from STMicroelectronics, a leader in cutting-edge semiconductor technology. This N-channel RF Power FET is designed for exceptional amplification in ultra-high frequency applications, ensuring reliability and efficiency. With robust construction and superior thermal management, it delivers up to 2.5 A of current and withstands high temperatures. Experience quality you can trust, driving innovation in your projects and powering your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging provides durability and reliability while being lightweight, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel devices typically offer lower on-resistance and higher efficiency, which is ideal for high-performance applications.

Configuration: SINGLE

A single configuration simplifies integration into circuits, allowing for easier design and reduced complexity.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is suitable for enhancing signal strength in various electronics.

Surface Mount: YES

Surface mount technology enables compact circuit designs and automated assembly, giving an edge in manufacturing efficiency.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65 V ensures reliable operation in high-voltage applications, enhancing safety and reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for optimal layout in circuit boards, maximizing space usage while ensuring effective heat dissipation.

Terminal Form: GULL WING

Gull wing terminals facilitate better soldering and mechanical stability, ensuring a secure connection on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for significant control over the device, making it versatile for various applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra high frequency band, this FET is suitable for advanced communication and radar applications.

Maximum Drain Current (Abs) (ID): 2.5 A

Featuring a maximum drain current of 2.5 A, this FET can effectively drive loads without overheating, ensuring efficiency.

No. of Terminals: 2

With only 2 terminals, this FET provides straightforward connections, simplifying circuit design and layout.

Maximum Power Dissipation (Abs): 31.7 W

A power dissipation capability of 31.7 W allows for efficient thermal management, promoting reliable long-term operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB while maintaining high performance, ideal for compact devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, contributing to the efficiency and effectiveness of the transistor.

Maximum Operating Temperature: 165 °C

A high operating temperature rating of 165 °C ensures reliable performance even in demanding thermal environments.

Transistor Element Material: SILICON

Silicon as the element material provides a balance of performance and cost-effectiveness, making it a widely used choice in FETs.

Terminal Finish: MATTE TIN

A matte tin terminal finish offers excellent solderability and reduces oxidation, enhancing long-term connection reliability.

Maximum Drain Current (ID): 2.5 A

Reiterating a robust maximum drain current capability of 2.5 A ensures this FET is well-suited for a variety of load conditions.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit designs and layouts, enhancing overall design versatility.

Case Connection: SOURCE

A source case connection improves thermal performance and simplifies circuit layout for efficient designs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time capability of 30 seconds supports robust solder connections during automated assembly processes.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C allows for compatibility with modern soldering processes, ensuring ease of manufacturing.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57018TR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57018TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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