Loading...

PD57002-01

STMicroelectronics

PD57002-01 by STMicroelectronics

PD57002-01 by STMicroelectronics is an N-channel RF power FET designed for switching applications. It features a 65V breakdown voltage, operates at ultra-high frequencies, and supports a max drain current of 0.25A. Ideal for compact, high-performance circuits in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,828

-

-

-

-

Digiode

USA . 2,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,130

-

-

-

-

Anansix

USA . 1,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,829

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$1.752

100+ parts

-

1k+ parts

$1.577

10k+ parts

-

1,185

$1.752

-

$1.577

-

MKK Technologies

India . 1,592 parts In-Stock

1+ parts

$3.294

100+ parts

-

1k+ parts

-

10k+ parts

-

1,592

$3.294

-

-

-

DigiPath Technology Company

USA . 1,592 parts In-Stock

1+ parts

$3.294

100+ parts

-

1k+ parts

-

10k+ parts

-

1,592

$3.294

-

-

-

Corphita

USA . 4,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,982

-

-

-

-

Parana Technologies

USA . 868 parts In-Stock

1+ parts

-

100+ parts

$2.094

1k+ parts

-

10k+ parts

-

868

-

$2.094

-

-

Overview

Elevate your designs with the PD57002-01 from STMicroelectronics, a leader in semiconductor innovation. This N-channel RF Power FET is crafted for precision switching applications, delivering exceptional performance in ultra-high frequency environments. With its robust construction and advanced technology, it guarantees reliability and efficiency, making it ideal for a range of applications. Trust STMicroelectronics to power your next project with unmatched quality and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a lightweight and durable package, ensuring reliable performance in various environments.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration is ideal for high-speed switching applications, making it suitable for a wide range of RF power applications.

Configuration: SINGLE

The single configuration simplifies circuit design and minimizes space requirements on PCBs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently handle rapid ON/OFF cycles, enhancing performance in RF circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and improved reliability by minimizing signal loss and maximizing heat dissipation.

Minimum DS Breakdown Voltage: 65 V

A breakdown voltage of 65V ensures reliability in high-voltage applications, increasing the range of compatible use cases.

Package Shape: SQUARE

The square shape provides significant space-saving benefits, allowing for more efficient layout and integration into circuits.

Terminal Form: NO LEAD

No lead design reduces size and improves compatibility with modern soldering techniques, further streamlining the assembly process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better control over the device, providing excellent performance in digital and analog switching applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band makes this FET ideal for communication applications that require fast signal processing.

Maximum Drain Current (Abs) (ID): 0.25 A

A maximum drain current of 0.25A enables efficient operation without overheating, suitable for moderate power applications.

No. of Terminals: 5

With five terminals, this FET offers versatility in connections, making it adaptable to various circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style facilitates easy integration into various systems, promoting flexibility in design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency and fast switching capabilities, making this device suitable for demanding RF applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability in rugged environments, supporting applications where heat might be a concern.

Transistor Element Material: SILICON

Silicon is known for its excellent electrical characteristics, making it a stable and efficient choice for RF power applications.

Maximum Drain Current (ID): 0.25 A

This specification supports consistent and reliable performance for applications that require controlled power handling.

Terminal Position: QUAD

The quad terminal position enhances layout flexibility on PCB designs, allowing for efficient routing of signals.

Case Connection: SOURCE

The source case connection simplifies the design and ensures effective thermal management and performance consistency.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57002-01 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

.25 A

Maximum Drain Current (ID):

.25 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PD57002-01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19