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PD57070-E

STMicroelectronics

PD57070-E by STMicroelectronics

STMicroelectronics' PD57070-E is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage and 7A Drain Current. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features a PLASTIC/EPOXY package, SINGLE configuration, and operates in ENHANCEMENT MODE at up to 165°C.

Median Price

$31.940

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$30.580

100+ parts

-

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-

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1

$30.580

-

-

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Verical

USA . 1 parts In-Stock

1+ parts

$30.580

100+ parts

-

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-

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-

1

$30.580

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-

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Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$33.300

100+ parts

-

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-

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-

1

$33.300

-

-

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DigiKey

USA . 18 parts In-Stock

1+ parts

$61.350

100+ parts

-

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18

$61.350

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Distributors (In-Stock)

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Digiode

USA . 165 parts In-Stock

1+ parts

$29.051

100+ parts

-

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165

$29.051

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Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$30.940

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70

$30.940

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Vyrian

USA . 5,006 parts In-Stock

1+ parts

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5,006

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Anansix

USA . 2,849 parts In-Stock

1+ parts

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2,849

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,078 parts In-Stock

1+ parts

$1.473

100+ parts

-

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-

10k+ parts

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1,078

$1.473

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$1.541

100+ parts

$1.402

1k+ parts

$1.264

10k+ parts

-

10

$1.541

$1.402

$1.264

-

IDEA Electronic Components Group

UK . 2,327 parts In-Stock

1+ parts

$1.806

100+ parts

-

1k+ parts

$1.625

10k+ parts

-

2,327

$1.806

-

$1.625

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MKK Technologies

India . 34 parts In-Stock

1+ parts

$3.396

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34

$3.396

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DigiPath Technology Company

USA . 34 parts In-Stock

1+ parts

$3.396

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34

$3.396

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AZTECH Wire

Italy . 262 parts In-Stock

1+ parts

$13.712

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262

$13.712

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Ampacity Inc.

Singapore . 5 parts In-Stock

1+ parts

$25.990

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5

$25.990

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Semicontronic

India . 5 parts In-Stock

1+ parts

$25.990

100+ parts

$25.340

1k+ parts

$25.210

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5

$25.990

$25.340

$25.210

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Corphita

USA . 348 parts In-Stock

1+ parts

$27.522

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348

$27.522

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Component Stockers USA

USA . 2 parts In-Stock

1+ parts

$29.530

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2

$29.530

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Continental Prestige Electronics

USA . 2,077 parts In-Stock

1+ parts

$30.940

100+ parts

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$30.321

2,077

$30.940

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$30.321

Corohmni

South Africa . 450 parts In-Stock

1+ parts

$39.075

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450

$39.075

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Microchip USA

USA . 298 parts In-Stock

1+ parts

$144.256

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298

$144.256

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Argo Parts USA

USA . 4,257 parts In-Stock

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4,257

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Parana Technologies

USA . 1,352 parts In-Stock

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$2.159

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1,352

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$2.159

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Perfect Parts

USA . 222 parts In-Stock

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222

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Netroflash

USA . 50 parts In-Stock

1+ parts

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$30.321

1k+ parts

$29.393

10k+ parts

$28.774

50

-

$30.321

$29.393

$28.774

Overview

Experience unparalleled performance and reliability with the PD57070-E RF Power Field Effect Transistor by STMicroelectronics. Designed for amplifier applications in the ultra-high-frequency band, this N-channel transistor offers exceptional power dissipation of up to 95W and a minimum DS breakdown voltage of 65V. With a single configuration and gull-wing terminals for easy installation, this enhancement mode transistor is a game-changer in the industry. Trust in STMicroelectronics' cutting-edge technology and superior quality to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and heat resistance, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer better performance in many applications compared to P-Channel FETs, making this product a good choice for amplification.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on circuit boards.

Maximum Drain Current (ID): 7 A

High maximum drain current allows for efficient power handling, making this FET suitable for high-power applications.

Maximum Power Dissipation (Abs): 95 W

With a high maximum power dissipation, this FET can handle higher power levels without overheating.

Maximum Operating Temperature: 165 °C

The high maximum operating temperature ensures the FET can withstand elevated temperatures without performance degradation.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57070-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57070-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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