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PD57030S-E

STMicroelectronics

PD57030S-E by STMicroelectronics

PD57030S-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 4 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact device ensures efficient performance in demanding environments.

Median Price

$40.938

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 17 parts In-Stock

1+ parts

$35.205

100+ parts

-

1k+ parts

$30.310

10k+ parts

-

17

$35.205

-

$30.310

-

Arrow

USA . 20 parts In-Stock

1+ parts

$46.670

100+ parts

-

1k+ parts

$33.631

10k+ parts

-

20

$46.670

-

$33.631

-

EBV Elektronik

Germany . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 192 parts In-Stock

1+ parts

$33.445

100+ parts

-

1k+ parts

-

10k+ parts

-

192

$33.445

-

-

-

Vyrian

USA . 6,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,340

-

-

-

-

Anansix

USA . 72 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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72

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,738 parts In-Stock

1+ parts

$0.594

100+ parts

-

1k+ parts

$0.535

10k+ parts

-

1,738

$0.594

-

$0.535

-

MKK Technologies

India . 1,877 parts In-Stock

1+ parts

$1.118

100+ parts

-

1k+ parts

-

10k+ parts

-

1,877

$1.118

-

-

-

DigiPath Technology Company

USA . 1,877 parts In-Stock

1+ parts

$1.118

100+ parts

-

1k+ parts

-

10k+ parts

-

1,877

$1.118

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$1.186

100+ parts

$1.079

1k+ parts

$0.973

10k+ parts

-

50

$1.186

$1.079

$0.973

-

AZTECH Wire

Italy . 592 parts In-Stock

1+ parts

$10.910

100+ parts

-

1k+ parts

-

10k+ parts

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592

$10.910

-

-

-

Corphita

USA . 4,578 parts In-Stock

1+ parts

$31.684

100+ parts

-

1k+ parts

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10k+ parts

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4,578

$31.684

-

-

-

Component Stockers USA

USA . 21 parts In-Stock

1+ parts

$32.560

100+ parts

-

1k+ parts

-

10k+ parts

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21

$32.560

-

-

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,000

-

-

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Parana Technologies

USA . 598 parts In-Stock

1+ parts

-

100+ parts

$0.711

1k+ parts

-

10k+ parts

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598

-

$0.711

-

-

Perfect Parts

USA . 280 parts In-Stock

1+ parts

-

100+ parts

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280

-

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-

Overview

Unlock the power of innovation with the PD57030S-E from STMicroelectronics, a leader in semiconductor technology. This N-channel RF Power FET is designed for superior amplification in ultra-high-frequency applications, delivering exceptional reliability and efficiency. With its compact design and robust thermal performance, this transistor ensures optimal operation even in demanding environments. Elevate your projects with ST's unwavering commitment to quality and performance—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers a lightweight and durable package that is well-suited for various applications, enhancing reliability.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration provides efficient conduction, making it ideal for high-speed switching applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces component count, which can improve overall system reliability.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is suitable for audio and RF applications, providing high performance in signal processing.

Surface Mount: YES

Surface mount capability allows for compact design and efficient heat dissipation, making it suitable for modern electronic devices.

Minimum DS Breakdown Voltage: 65 V

With a high breakdown voltage, this transistor can operate safely in high-voltage applications, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various circuit boards and optimized space utilization.

Terminal Form: FLAT

Flat terminals facilitate better soldering and ensure reliable connections, which are crucial for circuit performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides improved control and efficiency in switching applications, making this FET a great choice for precise applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The ability to operate in the ultra-high frequency band makes it ideal for wireless and telecommunications applications.

Maximum Drain Current (Abs) (ID): 4 A

With a maximum drain current of 4 A, this FET can handle significant power loads, making it suitable for demanding applications.

No. of Terminals: 2

The two-terminal design simplifies the circuit layout and reduces complexity, making it user-friendly.

Maximum Power Dissipation (Abs): 52.8 W

High power dissipation capability allows for reliable operation under heavy load conditions, ensuring longevity and durability.

Package Style (Meter): SMALL OUTLINE

A small outline package style enables compact designs, making it well-suited for portable electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides improved efficiency and lower on-resistance, making this FET energy-efficient and cost-effective.

Maximum Operating Temperature: 165 °C

The high operating temperature threshold enhances reliability in harsh environments, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon is a proven material known for its efficiency and performance in electronic components, ensuring high-quality operation.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and improves corrosion resistance, ensuring long-lasting performance in various environments.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, accommodating various design requirements.

Case Connection: SOURCE

Source case connection provides optimal layouts for circuit design, contributing to enhanced performance in applications.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures compatibility with standard PCB assembly processes, making integration smoother.

Peak Reflow Temperature °C: 250

Operating at a reflow temperature of 250 °C ensures compatibility with modern soldering techniques, improving manufacturing efficiency.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57030S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57030S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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