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PD57018STR-E

STMicroelectronics

PD57018STR-E by STMicroelectronics

PD57018STR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 2.5 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact surface-mount device ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,859 parts In-Stock

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7,859

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Anansix

USA . 1,891 parts In-Stock

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1,891

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Digiode

USA . 815 parts In-Stock

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815

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 20 parts In-Stock

1+ parts

$0.430

100+ parts

-

1k+ parts

$0.387

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20

$0.430

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$0.387

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MKK Technologies

India . 1,156 parts In-Stock

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$0.808

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1,156

$0.808

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DigiPath Technology Company

USA . 1,156 parts In-Stock

1+ parts

$0.808

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1,156

$0.808

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AZTECH Wire

Italy . 262 parts In-Stock

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$10.260

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262

$10.260

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Microchip USA

USA . 276 parts In-Stock

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$54.268

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276

$54.268

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Corphita

USA . 2,944 parts In-Stock

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Perfect Parts

USA . 1,997 parts In-Stock

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1,997

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Parana Technologies

USA . 110 parts In-Stock

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$0.514

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110

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$0.514

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Overview

Unlock superior performance with the PD57018STR-E from STMicroelectronics, a leader in innovative semiconductor solutions. This RF Power FET delivers exceptional efficiency and reliability for high-frequency applications, making it perfect for amplifiers in communication systems. With its robust design and advanced technology, you gain unmatched durability and power handling capabilities, ensuring your projects achieve their full potential. Experience quality and excellence that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower ON resistance and better efficiency, making them ideal for amplification applications.

Configuration: SINGLE

A single configuration simplifies integration into circuits, providing ease of use.

Transistor Application: AMPLIFIER

Designed specifically for amplification, ensuring optimal performance in signal processing.

Surface Mount: YES

Surface mount capability allows for more compact circuit designs and easier assembly.

Minimum DS Breakdown Voltage: 65 V

A high breakdown voltage ensures reliability and resilience in demanding applications.

Package Shape: RECTANGULAR

Rectangular packages provide better space management on PCBs, enhancing overall design efficiency.

Terminal Form: FLAT

Flat terminals facilitate better soldering and connectivity, improving mechanical stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enables higher performance and efficiency, making it suitable for a variety of applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This capability makes the product suitable for high-frequency applications, essential for modern communication systems.

Maximum Drain Current (Abs) (ID): 2.5 A

The ability to handle 2.5 A of current allows for robust performance in power applications.

No. of Terminals: 2

A simple two-terminal design enhances ease of use and reduces potential connection errors.

Maximum Power Dissipation (Abs): 31.7 W

High power dissipation capability ensures effective thermal management, enhancing reliability under load.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for efficient use of space on PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and less power consumption, making it ideal for low-power applications.

Maximum Operating Temperature: 165 °C

A high operating temperature rating ensures reliable performance in harsh conditions.

Transistor Element Material: SILICON

Silicon material is well-established and reliable for electronic applications, ensuring performance consistency.

Terminal Finish: MATTE TIN

Matte tin provides good solderability, enhancing manufacturing and assembly processes.

Maximum Drain Current (ID): 2.5 A

This specification confirms the device's ability to handle substantial current loads effectively.

Terminal Position: DUAL

Dual terminal position enhances flexibility in circuit design, allowing for optimal placement.

Case Connection: SOURCE

Direct case connection to the source streamlines circuit design and enhances signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

This ensures compatibility with standard soldering practices, promoting reliability in assembly.

Peak Reflow Temperature °C: 250

The high reflow temperature rating allows for robust assembly processes, ensuring component reliability.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57018STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57018STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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