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PD57006-E

STMicroelectronics

PD57006-E by STMicroelectronics

PD57006-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 1 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact device supports surface mount technology with a max temp of 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,317 parts In-Stock

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8,317

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Chip Stock

USA . 2,700 parts In-Stock

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2,700

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Anansix

USA . 2,050 parts In-Stock

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2,050

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Digiode

USA . 995 parts In-Stock

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995

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IDEA Electronic Components Group

UK . 2,252 parts In-Stock

1+ parts

$1.752

100+ parts

-

1k+ parts

$1.577

10k+ parts

-

2,252

$1.752

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$1.577

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$2.204

100+ parts

$2.006

1k+ parts

$1.807

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-

2,000

$2.204

$2.006

$1.807

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MKK Technologies

India . 450 parts In-Stock

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$3.294

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450

$3.294

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DigiPath Technology Company

USA . 450 parts In-Stock

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$3.294

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450

$3.294

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AZTECH Wire

Italy . 713 parts In-Stock

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$9.130

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713

$9.130

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Component Stockers USA

USA . 349 parts In-Stock

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$99.990

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349

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 9,078 parts In-Stock

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9,078

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Corphita

USA . 2,953 parts In-Stock

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2,953

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Perfect Parts

USA . 748 parts In-Stock

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748

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Parana Technologies

USA . 644 parts In-Stock

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$2.094

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644

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$2.094

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Assy Fe

Spain . 10 parts In-Stock

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Overview

Unlock the power of innovation with the PD57006-E from STMicroelectronics, a premium RF Power FET designed for superior amplification in ultra-high frequency applications. Renowned for its reliability and efficiency, STMicroelectronics ensures top-notch quality that enhances your projects' performance. With a compact design and robust thermal management, this product delivers outstanding value, empowering engineers to create cutting-edge solutions with confidence. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing plastic/epoxy as the package body material provides excellent durability and protects against environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are typically preferred for their higher efficiency and faster switching speeds compared to P-channel transistors.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces space requirements, making it ideal for compact electronic designs.

Transistor Application: AMPLIFIER

Designed for amplification applications, this FET is suitable for improving signal strength in RF communication systems.

Surface Mount: YES

Surface mount capability allows for automated assembly and saves space on printed circuit boards, enhancing design flexibility.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65 V indicates reliable performance in higher voltage applications, ensuring robustness.

Package Shape: RECTANGULAR

The rectangular shape of the package optimizes space on the PCB and aids in thermal dissipation.

Terminal Form: GULL WING

Gull wing terminals provide good soldering results and ease of assembly, improving overall manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures greater control over the transistor's conductivity, which leads to better performance in switching applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for ultra high frequency applications, this FET excels in communications and radar technology.

Maximum Drain Current (Abs) (ID): 1 A

A maximum drain current of 1 A allows the FET to handle moderate power levels efficiently, making it versatile for numerous applications.

No. of Terminals: 2

A 2-terminal design enhances simplicity, reducing potential failure points in circuit connections.

Maximum Power Dissipation (Abs): 20 W

With a maximum power dissipation of 20 W, this FET can handle substantial power loads, ideal for robust RF applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to compact designs, making it a good option for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of Metal-Oxide Semiconductor technology enhances performance characteristics such as efficiency and scalability.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliability in harsh environments, extending the product's lifespan.

Transistor Element Material: SILICON

Silicon as the transistor element material provides excellent thermal and electrical performance, ensuring stability in operations.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish enhances solderability and corrosion resistance, ensuring reliable long-term connections.

Maximum Drain Current (ID): 1 A

A repeat of 1 A maximum drain current underscores its ability to manage current effectively without overheating.

Terminal Position: DUAL

The dual terminal position offers flexibility in design and layout, simplifying PCB routing.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is designed to withstand typical humidity levels found in electronic environments.

Case Connection: SOURCE

Source case connection facilitates efficient thermal management and ease of integration in circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for up to 30 seconds at peak reflow temperature to ensure proper soldering without damaging the component.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C enables compatibility with high-temperature soldering processes common in modern manufacturing.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57006-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57006-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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