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PD57060TR-E

STMicroelectronics

PD57060TR-E by STMicroelectronics

PD57060TR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This compact surface-mount transistor ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,602 parts In-Stock

1+ parts

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3,602

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Anansix

USA . 2,438 parts In-Stock

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2,438

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Vyrian

USA . 2,181 parts In-Stock

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2,181

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$0.671

100+ parts

$0.611

1k+ parts

$0.550

10k+ parts

-

2,000

$0.671

$0.611

$0.550

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IDEA Electronic Components Group

UK . 2,225 parts In-Stock

1+ parts

$0.937

100+ parts

-

1k+ parts

$0.843

10k+ parts

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2,225

$0.937

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$0.843

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MKK Technologies

India . 1,928 parts In-Stock

1+ parts

$1.761

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1,928

$1.761

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DigiPath Technology Company

USA . 1,928 parts In-Stock

1+ parts

$1.761

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1,928

$1.761

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$20.560

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581

$20.560

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Microchip USA

USA . 3,468 parts In-Stock

1+ parts

$112.712

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3,468

$112.712

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Corphita

USA . 2,755 parts In-Stock

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2,755

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Parana Technologies

USA . 1,161 parts In-Stock

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$1.120

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1,161

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$1.120

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Overview

Elevate your projects with the PD57060TR-E from STMicroelectronics – a top-tier RF Power FET designed for unparalleled performance in amplifier applications. Renowned for exceptional quality and innovation, STMicroelectronics delivers reliable solutions that empower engineers to achieve their vision. Whether you're in telecommunications or automotive systems, this N-channel transistor ensures efficiency, durability, and superior signal clarity, making it the ideal choice for next-gen designs. Unlock limitless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making it suitable for various applications in RF systems.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher efficiency and better performance in amplification applications, enhancing device reliability.

Configuration: SINGLE

A single configuration simplifies integration into circuits, making it easier to implement and minimize layout complexity.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is optimized for signal processing, making it ideal for RF applications.

Surface Mount: YES

Surface mount technology facilitates compact design and efficient manufacturing processes, saving space on PCB.

Minimum DS Breakdown Voltage: 65 V

A breakdown voltage of 65 V allows for reliable operation in high-voltage RF applications, enhancing system safety.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs and is typically easier to handle in automated assembly processes.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and facilitate easier handling during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation results in higher efficiency and better switching performance, making this FET ideal for high-speed applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, this FET can handle demanding RF signals, making it suitable for advanced communication systems.

Maximum Drain Current (Abs): 7 A

With a maximum drain current of 7 A, this device can handle substantial power loads, suitable for high-performance circuits.

No. of Terminals: 2

A two-terminal design simplifies connections and reduces potential points of failure in RF applications.

Maximum Power Dissipation (Abs): 0.079 W

Low power dissipation allows for efficient operation and minimizes thermal management concerns in RF circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact design and is suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making it an excellent choice for RF circuit designs.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature ensures reliable performance under demanding environmental conditions.

Transistor Element Material: SILICON

Silicon transistors provide robust performance and are widely used in high-frequency applications, ensuring compatibility and availability.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish enhances solderability and prevents oxidation, improving the reliability of connections.

Maximum Drain Current (ID): 7 A

This specification indicates the same capability for handling significant current loads as previously mentioned, reinforcing its suitability for high-performance circuits.

Terminal Position: DUAL

Dual position terminals provide versatile mounting options, facilitating easier integration into various circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, allowing for some handling flexibility while needing caution during storage and assembly.

Case Connection: SOURCE

Direct source connection ensures effective heat dissipation and improves overall device performance.

Maximum Time At Peak Reflow Temperature (s): 30

Allowing for a maximum peak reflow time ensures that the FET can be processed efficiently without compromising performance reliability.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C accommodates modern soldering techniques, ensuring compatibility with various manufacturing processes.

Technical Specifications

RF Power Field Effect Transistors (FET) PD57060TR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD57060TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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