Loading...

LET9045S

STMicroelectronics

LET9045S by STMicroelectronics

LET9045S by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 9 A, breakdown voltage of 80 V, and operates in the ultra-high frequency band. Ideal for compact, high-performance circuits.

Median Price

$34.660

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 50 parts In-Stock

1+ parts

$34.660

100+ parts

$34.660

1k+ parts

$34.660

10k+ parts

$34.660

50

$34.660

$34.660

$34.660

$34.660

Verical

USA . 50 parts In-Stock

1+ parts

$34.660

100+ parts

$34.660

1k+ parts

$34.660

10k+ parts

$34.660

50

$34.660

$34.660

$34.660

$34.660

Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$38.200

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$38.200

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 221 parts In-Stock

1+ parts

$32.927

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$32.927

-

-

-

Bristol Electronics

USA . 179 parts In-Stock

1+ parts

$81.900

100+ parts

$67.158

1k+ parts

-

10k+ parts

-

179

$81.900

$67.158

-

-

Vyrian

USA . 6,798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,798

-

-

-

-

Anansix

USA . 728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

728

-

-

-

-

Lakeland Logistics Inc

USA . 179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

179

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,402 parts In-Stock

1+ parts

$0.855

100+ parts

-

1k+ parts

$0.769

10k+ parts

-

1,402

$0.855

-

$0.769

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.147

100+ parts

$1.044

1k+ parts

$0.941

10k+ parts

-

100

$1.147

$1.044

$0.941

-

MKK Technologies

India . 287 parts In-Stock

1+ parts

$1.607

100+ parts

-

1k+ parts

-

10k+ parts

-

287

$1.607

-

-

-

DigiPath Technology Company

USA . 287 parts In-Stock

1+ parts

$1.607

100+ parts

-

1k+ parts

-

10k+ parts

-

287

$1.607

-

-

-

AZTECH Wire

Italy . 959 parts In-Stock

1+ parts

$18.650

100+ parts

-

1k+ parts

-

10k+ parts

-

959

$18.650

-

-

-

Corphita

USA . 992 parts In-Stock

1+ parts

$31.194

100+ parts

-

1k+ parts

-

10k+ parts

-

992

$31.194

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Parana Technologies

USA . 295 parts In-Stock

1+ parts

-

100+ parts

$1.022

1k+ parts

-

10k+ parts

-

295

-

$1.022

-

-

Perfect Parts

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Overview

Unlock exceptional performance with the LET9045S from STMicroelectronics, a leader in RF power solutions. This N-channel FET is expertly designed for ultra-high frequency amplification, delivering reliability and efficiency for your most demanding applications. With robust heat management and impressive power capabilities, it enhances system longevity while minimizing downtime. Trust STMicroelectronics to bring quality and innovation right to your projects, ensuring you stay ahead in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers excellent durability and thermal stability, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide higher efficiency and are well-suited for applications in amplifiers and switching power supplies.

Configuration: SINGLE

A single configuration simplifies circuit design, making it easier and more cost-effective to integrate into various electronic systems.

Transistor Application: AMPLIFIER

Optimized for amplification, this FET is an excellent choice for RF applications, enhancing signal strength and quality.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, improving manufacturing efficiency and reducing board space.

Minimum DS Breakdown Voltage: 80 V

The minimum breakdown voltage of 80V ensures reliability in high-voltage applications, safeguarding against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy placement on PCBs and effective thermal management.

Terminal Form: FLAT

Flat terminals enable efficient soldering and provide stable electrical connections for high-performance applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the transistor remains off until a gate voltage is applied, offering better control and energy efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra-high frequency range, this FET is ideal for advanced communication systems and RF applications.

Maximum Drain Current (Abs) (ID): 5 A

With a maximum drain current of 5A, this FET can drive substantial loads, making it versatile for various power applications.

No. of Terminals: 2

A 2-terminal design simplifies connections and helps reduce potential points of failure in electronic circuits.

Maximum Power Dissipation (Abs): 160 W

A high power dissipation rating of 160W indicates that this FET can handle significant heat, enhancing stability and performance in demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style maximizes board space efficiency, perfect for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power consumption, making this FET suitable for low-power applications.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature of 165 °C allows the FET to function reliably in extreme environments.

Transistor Element Material: SILICON

Silicon as the element material provides excellent electrical properties, ensuring high performance and reliability.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and corrosion resistance, contributing to a longer lifespan of the components.

Maximum Drain Current (ID): 9 A

A maximum drain current of 9A provides flexibility for a wider range of applications, allowing for increased efficiency in power management.

Terminal Position: DUAL

Dual terminal positioning offers improved layout options for circuit designers, optimizing performance and minimizing signal losses.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FET is suitable for standard solder reflow processes, ensuring reliability in manufacturing.

Case Connection: SOURCE

Connecting the source to the case enhances thermal performance, allowing for efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds ensures compatibility with standard soldering processes while minimizing thermal stress on the component.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C allows for robust soldering practices, ensuring reliable connections and component integrity.

Technical Specifications

RF Power Field Effect Transistors (FET) LET9045S attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

9 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET9045S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19