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LET9085

STMicroelectronics

LET9085 by STMicroelectronics

LET9085 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 12 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This versatile component supports high power dissipation up to 186 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,266 parts In-Stock

1+ parts

-

100+ parts

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3,266

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Anansix

USA . 1,366 parts In-Stock

1+ parts

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1,366

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Digiode

USA . 1,123 parts In-Stock

1+ parts

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100+ parts

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1,123

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,261 parts In-Stock

1+ parts

$1.579

100+ parts

-

1k+ parts

$1.421

10k+ parts

-

2,261

$1.579

-

$1.421

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MKK Technologies

India . 2,030 parts In-Stock

1+ parts

$2.969

100+ parts

-

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-

10k+ parts

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2,030

$2.969

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DigiPath Technology Company

USA . 2,030 parts In-Stock

1+ parts

$2.969

100+ parts

-

1k+ parts

-

10k+ parts

-

2,030

$2.969

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Corphita

USA . 605 parts In-Stock

1+ parts

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605

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Parana Technologies

USA . 584 parts In-Stock

1+ parts

-

100+ parts

$1.888

1k+ parts

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584

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$1.888

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Overview

Unlock exceptional performance with the LET9085 by STMicroelectronics, a leader in innovative RF Power FETs. Designed for ultra-high frequency applications, this N-channel transistor delivers unparalleled efficiency and power handling, making it ideal for amplifiers across various industries. With STMicroelectronics' commitment to quality and reliability, the LET9085 ensures optimal performance, empowering your projects with enhanced durability and superior signal integrity. Experience the advantage of trusted technology that elevates your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and lightweight characteristics, making it suitable for various applications while ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and faster switching speeds, which are essential for high-performance amplifier applications.

Configuration: SINGLE

A single configuration simplifies circuit design and integration, making it easier for engineers to implement.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor is ideal for use in audio, RF, and other linear applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, leading to smaller and more efficient circuit boards.

Minimum DS Breakdown Voltage: 65 V

With a high breakdown voltage, the FET is suitable for high power applications, ensuring reliability under varying voltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCB layouts, contributing to more effective use of footprint area.

Terminal Form: FLAT

Flat terminals allow for easier soldering and improved thermal contact to the PCB, increasing overall reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation improves efficiency and reduces power consumption, making it suitable for modern applications that demand low power loss.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capability to operate in the UHF band makes it suitable for high-frequency applications, such as in telecommunications and broadcasting.

Maximum Drain Current (Abs) (ID): 12 A

A high maximum drain current supports heavy load applications, ensuring the transistor can handle demanding conditions.

No. of Terminals: 2

Having only two terminals simplifies the design and reduces the complexity of the assembly process, making it user-friendly.

Maximum Power Dissipation (Abs): 186 W

High power dissipation capability means the transistor can handle significant power loads without overheating, ensuring durability in high-performance scenarios.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers robust mounting options, enabling secure installation in various environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology is known for high efficiency and fast operation, making it very effective for switching and amplification tasks.

Maximum Operating Temperature: 200 °C

High operating temperature tolerance allows for use in demanding environments, enhancing reliability and longevity.

Transistor Element Material: SILICON

Silicon is widely used due to its excellent electronic properties, making it a reliable choice for various applications.

Terminal Position: DUAL

Dual terminal positioning facilitates better connection and layout flexibility in PCBs, improving overall circuit design.

Case Connection: SOURCE

Source connection improves the stability and performance of the transistor in circuit configurations, ensuring optimal operation.

Technical Specifications

RF Power Field Effect Transistors (FET) LET9085 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET9085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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