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LET9060STR

STMicroelectronics

LET9060STR by STMicroelectronics

LET9060STR by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 12 A, breakdown voltage of 80 V, and operates in the ultra-high frequency band. Ideal for compact, high-performance circuits with a small outline package.

Median Price

$43.789

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 553 parts In-Stock

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$43.789

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553

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$43.789

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,538 parts In-Stock

1+ parts

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3,538

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Vyrian

USA . 3,117 parts In-Stock

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3,117

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Anansix

USA . 646 parts In-Stock

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646

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 738 parts In-Stock

1+ parts

$1.267

100+ parts

-

1k+ parts

$1.140

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738

$1.267

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$1.140

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MKK Technologies

India . 1,044 parts In-Stock

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$2.382

100+ parts

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1,044

$2.382

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DigiPath Technology Company

USA . 1,044 parts In-Stock

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$2.382

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1,044

$2.382

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Perfect Parts

USA . 26,694 parts In-Stock

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26,694

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Corphita

USA . 4,653 parts In-Stock

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4,653

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Parana Technologies

USA . 420 parts In-Stock

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$1.515

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420

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$1.515

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Overview

Unlock unparalleled performance with the LET9060STR from STMicroelectronics, a leader in RF power technology. This N-channel FET excels in demanding applications, delivering exceptional amplification in ultra-high frequency bands. With robust design and remarkable power handling, it ensures reliability even in extreme conditions. Choose STMicroelectronics for cutting-edge innovation that empowers your projects, guaranteeing efficiency and longevity. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides good thermal stability and durability, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and higher efficiency, making them ideal for amplification tasks.

Configuration: SINGLE

A single configuration simplifies the design, reducing complexity and potential failure points in the circuit.

Transistor Application: AMPLIFIER

Designed explicitly for amplification, ensuring high performance and reliability in enhancing signal strength.

Surface Mount: YES

Surface mount technology enables compact designs and efficient assembly processes, reducing PCB space.

Minimum DS Breakdown Voltage: 80 V

A minimum breakdown voltage of 80V ensures robustness under high voltage conditions, enhancing reliability.

Package Shape: RECTANGULAR

Rectangular packaging maximizes space efficiency on printed circuit boards, allowing for optimized layout designs.

Terminal Form: FLAT

Flat terminals ensure good contact with the PCB, which enhances performance and reduces issues related to heat dissipation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides superior characteristics for switching applications, improving efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operates in the ultra-high frequency band, making it suitable for high-speed communication applications.

Maximum Drain Current (Abs) (ID): 7 A

A maximum drain current of 7 A supports high-power applications while maintaining stable performance.

No. of Terminals: 2

Two terminals simplify the connection and integration process in various circuit designs.

Maximum Power Dissipation (Abs): 170 W

High power dissipation capacity makes this FET suitable for high-power amplifiers and demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space on PCBs, allowing for more compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology improves efficiency and enables higher switching speeds, making it ideal for modern applications.

Maximum Operating Temperature: 165 °C

High operating temperature gives assurance for reliability in extreme conditions and longevity of the device.

Transistor Element Material: SILICON

Silicon offers excellent performance and thermal properties, ensuring dependable operation across various conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish improves solderability and corrosion resistance, enhancing long-term reliability.

Maximum Drain Current (ID): 12 A

A maximum current rating of 12 A offers versatility and capability for high-performance applications.

Terminal Position: DUAL

Dual terminal positions allow for flexible layout designs and easy integration into existing circuits.

Moisture Sensitivity Level (MSL): 3

MSL of 3 indicates reasonable moisture resistance, providing adequate reliability for standard manufacturing conditions.

Case Connection: SOURCE

Source connection is a standard setup in FETs, simplifying circuit design and improving compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds facilitates efficient soldering processes during production.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C ensures compatibility with advanced PCB assembly techniques.

Technical Specifications

RF Power Field Effect Transistors (FET) LET9060STR attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

12 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET9060STR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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