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PD55003TR-E

STMicroelectronics

PD55003TR-E by STMicroelectronics

STMicroelectronics PD55003TR-E is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage and 2.5A Drain Current. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features ENHANCEMENT MODE operation, 31.7W Power Dissipation, and operates up to 165°C temperature.

Median Price

$8.830

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,143 parts In-Stock

1+ parts

$8.830

100+ parts

$5.882

1k+ parts

$5.377

10k+ parts

$5.194

1,143

$8.830

$5.882

$5.377

$5.194

Mouser Electronics

USA . 438 parts In-Stock

1+ parts

$8.830

100+ parts

$5.710

1k+ parts

$5.570

10k+ parts

-

438

$8.830

$5.710

$5.570

-

Avnet

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,000

-

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.690

100+ parts

-

1k+ parts

-

10k+ parts

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50

$7.690

-

-

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Digiode

USA . 1,212 parts In-Stock

1+ parts

$8.388

100+ parts

-

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-

10k+ parts

-

1,212

$8.388

-

-

-

IBS Electronics

USA . 7,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.746

10k+ parts

-

7,200

-

-

$6.746

-

Chip Stock

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,600

-

-

-

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Vyrian

USA . 2,518 parts In-Stock

1+ parts

-

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-

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2,518

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Anansix

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

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125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 435 parts In-Stock

1+ parts

$0.532

100+ parts

-

1k+ parts

-

10k+ parts

-

435

$0.532

-

-

-

Aztec Data Supply Inc.

USA . 4,781 parts In-Stock

1+ parts

$0.540

100+ parts

-

1k+ parts

-

10k+ parts

-

4,781

$0.540

-

-

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IDEA Electronic Components Group

UK . 677 parts In-Stock

1+ parts

$1.441

100+ parts

-

1k+ parts

$1.297

10k+ parts

-

677

$1.441

-

$1.297

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MKK Technologies

India . 1,440 parts In-Stock

1+ parts

$2.709

100+ parts

-

1k+ parts

-

10k+ parts

-

1,440

$2.709

-

-

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DigiPath Technology Company

USA . 1,440 parts In-Stock

1+ parts

$2.709

100+ parts

-

1k+ parts

-

10k+ parts

-

1,440

$2.709

-

-

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Semicontronic

India . 5,369 parts In-Stock

1+ parts

$3.900

100+ parts

$3.802

1k+ parts

$3.783

10k+ parts

-

5,369

$3.900

$3.802

$3.783

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Ampacity Inc.

Singapore . 4,573 parts In-Stock

1+ parts

$3.900

100+ parts

-

1k+ parts

-

10k+ parts

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4,573

$3.900

-

-

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Continental Prestige Electronics

USA . 6,473 parts In-Stock

1+ parts

$7.690

100+ parts

-

1k+ parts

-

10k+ parts

$7.536

6,473

$7.690

-

-

$7.536

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.690

100+ parts

-

1k+ parts

$7.305

10k+ parts

$7.151

2,000

$7.690

-

$7.305

$7.151

Corphita

USA . 2,470 parts In-Stock

1+ parts

$7.947

100+ parts

-

1k+ parts

-

10k+ parts

-

2,470

$7.947

-

-

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Microchip USA

USA . 8,432 parts In-Stock

1+ parts

$21.531

100+ parts

-

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10k+ parts

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8,432

$21.531

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Lixinc

USA . 17,545 parts In-Stock

1+ parts

-

100+ parts

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17,545

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-

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A-Z Elektronik GmbH

Germany . 4,559 parts In-Stock

1+ parts

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100+ parts

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4,559

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-

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Argo Parts USA

USA . 3,442 parts In-Stock

1+ parts

-

100+ parts

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3,442

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-

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iodParts Technologies Inc.

India . 2,894 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,894

-

-

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Parana Technologies

USA . 1,911 parts In-Stock

1+ parts

-

100+ parts

$1.723

1k+ parts

-

10k+ parts

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1,911

-

$1.723

-

-

GreenTree Electronics

Israel . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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600

-

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-

Overview

Unlock unparalleled performance and reliability with the PD55003TR-E RF Power Field Effect Transistor by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL amplifier offers a vast range of applications in the ultra-high frequency band. Experience seamless operation and enhanced efficiency, with a maximum power dissipation of 31.7 W and a minimum DS breakdown voltage of 40 V. Elevate your projects with the unmatched quality and value that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Polarity or Channel Type: N-CHANNEL

Offers efficient performance in signal amplification.

Configuration: SINGLE

Simplified design for easy integration into various circuits.

Transistor Application: AMPLIFIER

Specifically designed for signal amplification, ensuring high-quality output.

Surface Mount: YES

Easy to install and suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 40 V

Can handle high voltage levels without damage, ensuring reliability.

Package Shape: RECTANGULAR

Space-efficient design for optimal circuit layout.

Maximum Drain Current (Abs) (ID): 2.5 A

Capable of handling high current levels for efficient operation.

Maximum Power Dissipation (Abs): 31.7 W

Efficient power handling capability for long-lasting performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and reliability in signal amplification applications.

Maximum Operating Temperature: 165 °C

Can operate efficiently even in high-temperature environments.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, ensuring longevity in various conditions.

Case Connection: SOURCE

Optimal connection for efficient signal transmission.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55003TR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55003TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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