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PD55003S-E

STMicroelectronics

PD55003S-E by STMicroelectronics

STMicroelectronics PD55003S-E is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage and 2.5A Drain Current. Ideal for AMPLIFIER applications, it operates in ENHANCEMENT MODE at ULTRA HIGH FREQUENCY BAND. This SINGLE configuration transistor comes in a PLASTIC/EPOXY package with Matte Tin finish, suitable for surface mount assembly.

Median Price

$10.960

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 96 parts In-Stock

1+ parts

$8.140

100+ parts

$5.520

1k+ parts

$5.450

10k+ parts

-

96

$8.140

$5.520

$5.450

-

Mouser Electronics

USA . 472 parts In-Stock

1+ parts

$10.380

100+ parts

$7.090

1k+ parts

-

10k+ parts

-

472

$10.380

$7.090

-

-

Newark

USA . 96 parts In-Stock

1+ parts

$10.960

100+ parts

$7.300

1k+ parts

-

10k+ parts

-

96

$10.960

$7.300

-

-

DigiKey

USA . 629 parts In-Stock

1+ parts

$11.130

100+ parts

$7.445

1k+ parts

$6.781

10k+ parts

-

629

$11.130

$7.445

$6.781

-

Element14

Singapore . 96 parts In-Stock

1+ parts

$13.680

100+ parts

$10.790

1k+ parts

$10.060

10k+ parts

-

96

$13.680

$10.790

$10.060

-

Avnet

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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200

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$7.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$7.680

-

-

-

Digiode

USA . 3,739 parts In-Stock

1+ parts

$9.557

100+ parts

-

1k+ parts

-

10k+ parts

-

3,739

$9.557

-

-

-

Anansix

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,200

-

-

-

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Vyrian

USA . 124 parts In-Stock

1+ parts

-

100+ parts

-

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-

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124

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 158 parts In-Stock

1+ parts

$1.030

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$1.030

-

-

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IDEA Electronic Components Group

UK . 2,126 parts In-Stock

1+ parts

$1.098

100+ parts

-

1k+ parts

$0.989

10k+ parts

-

2,126

$1.098

-

$0.989

-

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$1.345

100+ parts

$1.224

1k+ parts

$1.103

10k+ parts

-

350

$1.345

$1.224

$1.103

-

Corohmni

South Africa . 228 parts In-Stock

1+ parts

$1.627

100+ parts

-

1k+ parts

-

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228

$1.627

-

-

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MKK Technologies

India . 833 parts In-Stock

1+ parts

$2.066

100+ parts

-

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-

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833

$2.066

-

-

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DigiPath Technology Company

USA . 833 parts In-Stock

1+ parts

$2.066

100+ parts

-

1k+ parts

-

10k+ parts

-

833

$2.066

-

-

-

Continental Prestige Electronics

USA . 580 parts In-Stock

1+ parts

$7.442

100+ parts

-

1k+ parts

-

10k+ parts

$7.293

580

$7.442

-

-

$7.293

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$7.526

100+ parts

-

1k+ parts

$7.225

10k+ parts

-

2,000

$7.526

-

$7.225

-

Semicontronic

India . 296 parts In-Stock

1+ parts

$8.550

100+ parts

$8.336

1k+ parts

$8.294

10k+ parts

-

296

$8.550

$8.336

$8.294

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Ampacity Inc.

Singapore . 234 parts In-Stock

1+ parts

$8.550

100+ parts

-

1k+ parts

-

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234

$8.550

-

-

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Corphita

USA . 256 parts In-Stock

1+ parts

$9.054

100+ parts

-

1k+ parts

-

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256

$9.054

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Microchip USA

USA . 3,371 parts In-Stock

1+ parts

$33.068

100+ parts

-

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3,371

$33.068

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iodParts Technologies Inc.

India . 2,362 parts In-Stock

1+ parts

-

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2,362

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-

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Parana Technologies

USA . 1,892 parts In-Stock

1+ parts

-

100+ parts

$1.313

1k+ parts

-

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1,892

-

$1.313

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Argo Parts USA

USA . 1,358 parts In-Stock

1+ parts

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1,358

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Perfect Parts

USA . 1,064 parts In-Stock

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1,064

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Lixinc

USA . 220 parts In-Stock

1+ parts

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220

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Overview

Elevate your RF power applications with the PD55003S-E by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL RF Power FET offers unparalleled performance in amplifier applications within the ultra-high frequency band. With a maximum power dissipation of 31.7 W and a minimum DS breakdown voltage of 40 V, this single configuration transistor is designed to deliver optimal results. Trust in STMicroelectronics to provide top-notch quality and reliability, ensuring that your projects reach new heights of success. Choose the PD55003S-E for cutting-edge technology and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and performance in amplifier applications.

Configuration: SINGLE

Simplifies circuit design and integration, making it easy to use in amplifier setups.

Transistor Application: AMPLIFIER

Specifically designed for amplification tasks, ensuring optimal performance in audio and RF applications.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 40 V

Ensures reliable operation and protection against voltage spikes or fluctuations.

Package Shape: RECTANGULAR

Provides stability and ease of mounting, enhancing the overall durability of the transistor.

Terminal Form: FLAT

Facilitates a secure and stable connection, ensuring reliable performance in various environments.

Operating Mode: ENHANCEMENT MODE

Enables precise control over the transistor's operation, enhancing efficiency and performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ideal for high-frequency applications, ensuring reliable signal amplification in demanding environments.

No. of Elements: 1

Simplifies circuit design and integration, reducing complexity and ensuring consistent performance.

Maximum Drain Current (Abs) (ID): 2.5 A

Provides ample current capacity for various amplification tasks, ensuring reliable operation.

No. of Terminals: 2

Simplifies installation and connection, making it easy to integrate into circuit designs.

Maximum Power Dissipation (Abs): 31.7 W

Offers high power handling capability, ensuring the transistor can handle demanding applications.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on PCBs, making it suitable for compact and densely populated circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and performance, ensuring reliable amplification in various applications.

Maximum Operating Temperature: 165 °C

Suitable for operation in high-temperature environments, ensuring consistent performance in demanding conditions.

Transistor Element Material: SILICON

Offers high conductivity and reliability, ensuring long-term performance in amplifier applications.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a durable and reliable connection, ensuring stable operation in harsh environments.

Maximum Drain Current (ID): 2.5 A

Offers ample current capacity for various amplification tasks, ensuring reliable operation in demanding conditions.

Terminal Position: DUAL

Facilitates versatile installation options, allowing for flexible integration into circuit designs.

Moisture Sensitivity Level (MSL): 3

Indicates a moderate level of sensitivity to moisture, requiring proper handling and storage to maintain performance.

Case Connection: SOURCE

Simplifies circuit design and connection, ensuring easy integration into amplifier setups.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and reliable reflow soldering, ensuring secure connections during assembly.

Peak Reflow Temperature °C: 250

Enables efficient soldering and secure connections, ensuring reliable operation in various applications.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55003S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55003S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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