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PD55003-E

STMicroelectronics

PD55003-E by STMicroelectronics

STMicroelectronics PD55003-E is an N-CHANNEL RF Power FET for AMPLIFIER applications. It operates in ENHANCEMENT MODE at ULTRA HIGH FREQUENCY BAND with 40V DS Breakdown Voltage and 2.5A Drain Current. The PLASTIC/EPOXY package features GULL WING terminals, SMALL OUTLINE style, and can handle up to 31.7W power dissipation at 165°C max temperature.

Median Price

$8.278

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 330 parts In-Stock

1+ parts

$5.374

100+ parts

-

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330

$5.374

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Verical

USA . 330 parts In-Stock

1+ parts

$5.425

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-

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330

$5.425

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Mouser Electronics

USA . 6,491 parts In-Stock

1+ parts

$11.130

100+ parts

$7.130

1k+ parts

$7.120

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-

6,491

$11.130

$7.130

$7.120

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DigiKey

USA . 134 parts In-Stock

1+ parts

$11.130

100+ parts

$7.445

1k+ parts

$6.781

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134

$11.130

$7.445

$6.781

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Avnet

USA . 1,750 parts In-Stock

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1,750

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Distributors (In-Stock)

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Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$8.075

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86

$8.075

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TME

Poland . 9 parts In-Stock

1+ parts

$8.770

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9

$8.770

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Digiode

USA . 3,542 parts In-Stock

1+ parts

$10.574

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3,542

$10.574

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Chip Stock

USA . 10,500 parts In-Stock

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10,500

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Vyrian

USA . 1,434 parts In-Stock

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1,434

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Anansix

USA . 1,013 parts In-Stock

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1,013

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Distributors (Availability)

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Corohmni

South Africa . 259 parts In-Stock

1+ parts

$1.085

100+ parts

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259

$1.085

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$1.218

100+ parts

$1.158

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$1.158

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10

$1.218

$1.158

$1.158

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IDEA Electronic Components Group

UK . 1,921 parts In-Stock

1+ parts

$1.661

100+ parts

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$1.495

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1,921

$1.661

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$1.495

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Aztec Data Supply Inc.

USA . 278 parts In-Stock

1+ parts

$1.720

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278

$1.720

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Andel Nordic

Denmark . 1,449 parts In-Stock

1+ parts

$2.928

100+ parts

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$2.811

10k+ parts

$2.811

1,449

$2.928

-

$2.811

$2.811

MKK Technologies

India . 1,579 parts In-Stock

1+ parts

$3.123

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1,579

$3.123

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DigiPath Technology Company

USA . 1,579 parts In-Stock

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$3.123

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1,579

$3.123

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Ampacity Inc.

Singapore . 1,341 parts In-Stock

1+ parts

$5.730

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1,341

$5.730

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Semicontronic

India . 1,113 parts In-Stock

1+ parts

$5.730

100+ parts

$5.587

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$5.558

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1,113

$5.730

$5.587

$5.558

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Continental Prestige Electronics

USA . 6,499 parts In-Stock

1+ parts

$7.798

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$7.642

6,499

$7.798

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$7.642

Corphita

USA . 1,130 parts In-Stock

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$10.017

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1,130

$10.017

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Microchip USA

USA . 9,091 parts In-Stock

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$33.068

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9,091

$33.068

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Perfect Parts

USA . 44,315 parts In-Stock

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44,315

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iodParts Technologies Inc.

India . 28,918 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Lixinc

USA . 8,933 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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RC Electronics

USA . 4,432 parts In-Stock

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4,432

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Argo Parts USA

USA . 4,413 parts In-Stock

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4,413

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Parana Technologies

USA . 720 parts In-Stock

1+ parts

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$1.986

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720

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$1.986

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A-Z Elektronik GmbH

Germany . 239 parts In-Stock

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239

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Netroflash

USA . 100 parts In-Stock

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$7.913

1k+ parts

$7.671

10k+ parts

$7.510

100

-

$7.913

$7.671

$7.510

Overview

Elevate your RF power amplifier designs with the PD55003-E by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL FET offers unparalleled performance in the ultra-high frequency band. With a maximum power dissipation of 31.7W and a minimum DS breakdown voltage of 40V, this transistor is the perfect solution for your amplifier needs. Its small outline package and gull wing terminal form make it easy to integrate into your projects. Trust STMicroelectronics to deliver quality and reliability in every component, ensuring your applications run smoothly and efficiently. Experience the difference with the PD55003-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package makes this RF Power FET durable and resistant to impact, making it ideal for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient flow of electrons, enhancing the performance of this FET in amplifier applications.

Configuration: SINGLE

The single configuration simplifies the setup of this FET, making it easy to integrate into circuit designs.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET offers high performance and reliability in amplifying signals.

Surface Mount: YES

The surface mount capability of this FET allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle high voltage levels, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and efficient design, enabling easy integration into various electronic devices.

Terminal Form: GULL WING

The gull wing terminal form offers a secure connection and ease of soldering, ensuring reliable performance in circuit setups.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for precise control of the FET's conductivity, enabling efficient signal amplification.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra high frequency band, this FET is suitable for high-speed signal processing applications.

Maximum Drain Current (Abs) (ID): 2.5 A

With a maximum drain current of 2.5A, this FET can handle high current loads, making it suitable for power amplifier applications.

No. of Terminals: 2

The FET's two terminals simplify the connection process, making it easy to incorporate into circuit designs.

Maximum Power Dissipation (Abs): 31.7 W

With a maximum power dissipation of 31.7W, this FET can handle high power levels, ensuring reliable performance in demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs, making this FET suitable for applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology ensures high performance and efficiency in signal amplification.

Maximum Operating Temperature: 165 °C

With a maximum operating temperature of 165°C, this FET can operate in high-temperature environments without compromising performance.

Transistor Element Material: SILICON

The silicon material of the transistor element ensures reliability and stability in signal processing applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a reliable and durable terminal connection, ensuring long-term performance and stability.

Maximum Time At Peak Reflow Temperature (s): 30

This FET can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly processes.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this FET can withstand high-temperature soldering processes, ensuring secure and reliable connections.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55003-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55003-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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