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PD55025STR-E

STMicroelectronics

PD55025STR-E by STMicroelectronics

STMicroelectronics' PD55025STR-E is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage, ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. It features a SINGLE configuration, 7A ID, and operates in ENHANCEMENT MODE at up to 165°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,405 parts In-Stock

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4,405

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Vyrian

USA . 2,895 parts In-Stock

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2,895

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Anansix

USA . 688 parts In-Stock

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688

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Semicontronic

India . 1,393 parts In-Stock

1+ parts

$0.050

100+ parts

$0.049

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$0.048

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-

1,393

$0.050

$0.049

$0.048

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

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$1.758

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-

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$1.582

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1,952

$1.758

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$1.582

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MKK Technologies

India . 456 parts In-Stock

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$3.306

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456

$3.306

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DigiPath Technology Company

USA . 456 parts In-Stock

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$3.306

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456

$3.306

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AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$18.950

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878

$18.950

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Ampacity Inc.

Singapore . 578 parts In-Stock

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$41.050

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578

$41.050

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Argo Parts USA

USA . 4,661 parts In-Stock

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Corphita

USA . 3,396 parts In-Stock

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Continental Prestige Electronics

USA . 3,213 parts In-Stock

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3,213

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Parana Technologies

USA . 1,205 parts In-Stock

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$2.102

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$2.102

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Elevate your RF power amplifier design with the PD55025STR-E by STMicroelectronics. Known for their superior quality and advanced technology, STMicroelectronics brings you a single-channel N-CHANNEL FET that delivers exceptional performance in the ultra-high frequency band. This enhancement mode transistor offers a minimum DS breakdown voltage of 40V and a maximum drain current of 7A, making it ideal for a wide range of applications. With its small outline package and flat terminal form, this transistor is perfect for surface mount applications where space is at a premium. Experience the value and benefits of STMicroelectronics' cutting-edge technology with the PD55025STR-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the transistor suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have better performance characteristics compared to P-Channel FETs, making this transistor a good choice for amplification applications.

Configuration: SINGLE

Simplifies the circuit design and integration process for amplification applications.

Transistor Application: AMPLIFIER

Specifically designed for amplification purposes, ensuring optimal performance in such applications.

Surface Mount: YES

Easy to mount on printed circuit boards, simplifying the manufacturing process and reducing assembly time.

Minimum DS Breakdown Voltage: 40 V

Can handle higher voltages, making it suitable for applications that require voltage regulation or amplification.

Package Shape: RECTANGULAR

Efficient use of space on the circuit board and facilitates easy placement and orientation during assembly.

Terminal Form: FLAT

Allows for easier soldering and connection to the circuit, ensuring a secure and stable connection.

Operating Mode: ENHANCEMENT MODE

Provides better control over the transistor's conductivity, allowing for precise amplification in the circuit.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ideal for applications requiring high-frequency signal amplification, ensuring minimal signal distortion.

No. of Terminals: 2

Simplifies the circuit design and layout, reducing complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE

Compact size saves valuable space on the circuit board, especially in applications where size is a constraint.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers good performance characteristics, such as low input impedance and high switching speeds, making it suitable for amplification applications.

Maximum Operating Temperature: 165 °C

Can operate efficiently in high-temperature environments, ensuring reliable performance under varying conditions.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and stability, ensuring long-term performance of the transistor.

Maximum Drain Current (ID): 7 A

Capable of handling higher current loads, making it suitable for power amplification applications.

Terminal Position: DUAL

Provides flexibility in circuit design and layout, allowing for various connection configurations based on the application requirements.

Case Connection: SOURCE

The source connection simplifies the circuit design and ensures proper signal amplification through the transistor.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55025STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55025STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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