Loading...

PD55015STR-E

STMicroelectronics

PD55015STR-E by STMicroelectronics

STMicroelectronics' PD55015STR-E is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage and 7A Drain Current. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features a PLASTIC/EPOXY package, SINGLE configuration, and operates in ENHANCEMENT MODE.

Median Price

$16.401

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$16.401

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$16.401

-

-

-

Digiode

USA . 4,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,750

-

-

-

-

Vyrian

USA . 4,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,646

-

-

-

-

Anansix

USA . 2,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 551 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

551

$0.550

-

-

-

Corohmni

South Africa . 1,082 parts In-Stock

1+ parts

$1.138

100+ parts

-

1k+ parts

-

10k+ parts

-

1,082

$1.138

-

-

-

IDEA Electronic Components Group

UK . 2,007 parts In-Stock

1+ parts

$1.315

100+ parts

-

1k+ parts

$1.183

10k+ parts

-

2,007

$1.315

-

$1.183

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$1.578

100+ parts

$1.436

1k+ parts

$1.294

10k+ parts

-

5,000

$1.578

$1.436

$1.294

-

MKK Technologies

India . 1,783 parts In-Stock

1+ parts

$2.472

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$2.472

-

-

-

DigiPath Technology Company

USA . 1,783 parts In-Stock

1+ parts

$2.472

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$2.472

-

-

-

Continental Prestige Electronics

USA . 5,232 parts In-Stock

1+ parts

$16.253

100+ parts

-

1k+ parts

-

10k+ parts

$15.928

5,232

$16.253

-

-

$15.928

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$16.401

100+ parts

$16.073

1k+ parts

-

10k+ parts

-

1,000

$16.401

$16.073

-

-

AZTECH Wire

Italy . 778 parts In-Stock

1+ parts

$16.979

100+ parts

-

1k+ parts

-

10k+ parts

-

778

$16.979

-

-

-

Ampacity Inc.

Singapore . 1,636 parts In-Stock

1+ parts

$24.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,636

$24.050

-

-

-

Semicontronic

India . 1,200 parts In-Stock

1+ parts

$32.050

100+ parts

$31.249

1k+ parts

$31.088

10k+ parts

-

1,200

$32.050

$31.249

$31.088

-

Microchip USA

USA . 9,870 parts In-Stock

1+ parts

$45.738

100+ parts

-

1k+ parts

-

10k+ parts

-

9,870

$45.738

-

-

-

Corphita

USA . 4,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,960

-

-

-

-

Argo Parts USA

USA . 1,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,263

-

-

-

-

Parana Technologies

USA . 352 parts In-Stock

1+ parts

-

100+ parts

$1.572

1k+ parts

-

10k+ parts

-

352

-

$1.572

-

-

Overview

Unlock the power of cutting-edge technology with the PD55015STR-E RF Power Field Effect Transistor from STMicroelectronics. Designed for ultra-high frequency applications, this N-channel transistor offers unparalleled performance and reliability. Whether you're amplifying signals or enhancing your circuit design, this product delivers exceptional quality and value. With a maximum drain current of 7A and a maximum power dissipation of 79W, the PD55015STR-E is the perfect choice for your next project. Trust in STMicroelectronics for innovative solutions that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-Channel type transistors typically have better performance characteristics and lower resistance compared to P-Channel transistors.

Configuration: SINGLE

The single configuration simplifies the circuit design and makes it easier to integrate into various applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and facilitating automated manufacturing processes.

Minimum DS Breakdown Voltage: 40 V

A higher breakdown voltage ensures the transistor can handle higher voltages without damage, increasing the robustness of the overall circuit.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into various electronic devices.

Terminal Form: FLAT

Flat terminals provide a secure and stable connection to the circuit, minimizing the risk of signal distortion or loss.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer improved control over the amplification process, leading to better overall performance in amplifier applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency applications, ensuring reliable signal amplification in high-speed circuits.

Maximum Drain Current (Abs) (ID): 7 A

Capable of handling a maximum drain current of 7A, making it suitable for high-power amplifier applications.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit connections and reduces the risk of errors during installation.

Maximum Power Dissipation (Abs): 79 W

With a maximum power dissipation of 79W, this transistor can effectively manage heat dissipation during operation, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for high-density mounting of components in compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high performance and reliability, making this transistor suitable for demanding amplifier applications.

Maximum Operating Temperature: 165 °C

With a maximum operating temperature of 165°C, this transistor can operate reliably in high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon transistors are popular for their high performance and reliability, making this transistor a durable and efficient choice for amplifier applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a reliable and corrosion-resistant terminal surface, ensuring stable electrical connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and facilitates easy integration into various electronic systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the transistor has a moderate level of moisture sensitivity, making it suitable for a wide range of environmental conditions.

Case Connection: SOURCE

The source connection ensures optimal signal amplification and efficiency in amplifier applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this transistor can withstand soldering processes without damage.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C allows for reliable soldering of the transistor onto the PCB, ensuring secure electrical connections.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55015STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55015STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19