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PD55003

STMicroelectronics

PD55003 by STMicroelectronics

STMicroelectronics PD55003 is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage, suitable for AMPLIFIER applications. It operates in ENHANCEMENT MODE at ULTRA HIGH FREQUENCY BAND, with 2.5A Drain Current and 31.7W Power Dissipation in a SMALL OUTLINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 15,125 parts In-Stock

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15,125

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Vyrian

USA . 3,211 parts In-Stock

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3,211

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Anansix

USA . 1,531 parts In-Stock

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1,531

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Digiode

USA . 320 parts In-Stock

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320

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Nova Conductors

Japan . 58 parts In-Stock

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58

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,351 parts In-Stock

1+ parts

$0.528

100+ parts

-

1k+ parts

$0.475

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-

1,351

$0.528

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$0.475

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MKK Technologies

India . 2,204 parts In-Stock

1+ parts

$0.993

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-

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2,204

$0.993

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DigiPath Technology Company

USA . 2,204 parts In-Stock

1+ parts

$0.993

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-

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2,204

$0.993

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Corohmni

South Africa . 611 parts In-Stock

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$1.328

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611

$1.328

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Aztec Data Supply Inc.

USA . 2,123 parts In-Stock

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$1.520

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2,123

$1.520

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AZTECH Wire

Italy . 816 parts In-Stock

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$19.027

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816

$19.027

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Semicontronic

India . 954 parts In-Stock

1+ parts

$31.050

100+ parts

$30.274

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$30.118

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954

$31.050

$30.274

$30.118

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Ampacity Inc.

Singapore . 872 parts In-Stock

1+ parts

$65.050

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872

$65.050

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Lixinc

USA . 9,672 parts In-Stock

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Corphita

USA . 3,800 parts In-Stock

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Argo Parts USA

USA . 2,175 parts In-Stock

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2,175

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Parana Technologies

USA . 759 parts In-Stock

1+ parts

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$0.631

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759

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$0.631

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Continental Prestige Electronics

USA . 32 parts In-Stock

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32

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Overview

Elevate your RF power applications with the PD55003 by STMicroelectronics, a top-tier manufacturer known for delivering high-quality components. This N-channel RF power field effect transistor boasts a single configuration with an ultra-high frequency band, making it ideal for amplifier applications. With a maximum power dissipation of 31.7 W and a minimum breakdown voltage of 40V, this enhancement mode transistor offers exceptional performance and reliability. Upgrade your designs with the PD55003 and experience unparalleled value and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable housing for the transistor, ensuring long-term performance.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics compared to P-Channel transistors.

Configuration: SINGLE

Simplifies circuit design and makes it easier to integrate into a system.

Transistor Application: AMPLIFIER

Specifically designed for amplification applications, ensuring optimal performance in amplification circuits.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this transistor can handle higher voltages, increasing its versatility and reliability.

Terminal Form: GULL WING

Gull wing terminals are ideal for surface mount applications, providing secure connections and easy soldering.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and low off-state leakage current, improving overall efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed to operate in the ultra-high frequency band, making it suitable for high-speed applications.

Maximum Drain Current (Abs) (ID): 2.5 A

With a high maximum drain current, this transistor can handle high current loads without overheating.

No. of Terminals: 2

Simplified design with only 2 terminals, reducing complexity and improving reliability.

Maximum Power Dissipation (Abs): 31.7 W

High power dissipation capability allows the transistor to handle high power loads without damage.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space and is suitable for applications with limited board space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in transistor operation.

Maximum Operating Temperature: 165 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures, ensuring stable performance in various environments.

Transistor Element Material: SILICON

Silicon transistors are known for their reliability, high performance, and long lifespan.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and allows for various connection options.

Case Connection: SOURCE

Source connection allows for easy integration in source follower and common-source amplifier circuits.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55003 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

2.5 A

Maximum Drain Current (ID):

2.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55003 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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