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PD54008S-E

STMicroelectronics

PD54008S-E by STMicroelectronics

PD54008S-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 5 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This compact surface-mount device ensures efficient performance up to 165 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,935 parts In-Stock

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6,935

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Digiode

USA . 489 parts In-Stock

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489

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Anansix

USA . 138 parts In-Stock

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138

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NexGen Digital

USA . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,053 parts In-Stock

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$1.430

100+ parts

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$1.287

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1,053

$1.430

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$1.287

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MKK Technologies

India . 1,519 parts In-Stock

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$2.688

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1,519

$2.688

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DigiPath Technology Company

USA . 1,519 parts In-Stock

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$2.688

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1,519

$2.688

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AZTECH Wire

Italy . 1,206 parts In-Stock

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$11.000

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1,206

$11.000

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Ampacity Inc.

Singapore . 1,141 parts In-Stock

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$63.050

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$63.050

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Corphita

USA . 4,122 parts In-Stock

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4,122

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Parana Technologies

USA . 453 parts In-Stock

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$1.709

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453

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$1.709

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Perfect Parts

USA . 408 parts In-Stock

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Overview

Elevate your designs with the PD54008S-E from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance RF power FET excels in amplifier applications, delivering exceptional reliability and efficiency. With its compact surface-mount design and robust capabilities, it’s perfect for ultra-high frequency systems. Trust STMicroelectronics to provide quality and performance that accelerates your projects and enhances your competitive edge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures the transistor is lightweight and cost-effective, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel types typically offer higher electron mobility and efficiency, making them well-suited for high-speed switching applications.

Configuration: SINGLE

A single configuration allows for simplicity in circuit design, facilitating easier integration into various electronic systems.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is ideal for applications requiring signal boosting, such as in audio and RF circuits.

Surface Mount: YES

Surface mount technology provides a smaller footprint and allows for automated manufacturing processes, enhancing design flexibility.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle significant voltage levels, ensuring reliability in various applications.

Package Shape: RECTANGULAR

The rectangular shape supports effective layout on PCBs, promoting consistent performance and ease of integration.

Terminal Form: FLAT

Flat terminals facilitate better contact and heat dissipation during operation, improving the overall reliability of the device.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption until activated, making it energy-efficient in various applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra-high frequency range, this FET is suitable for advanced communication and radar technologies.

Maximum Drain Current (Abs) (ID): 5 A

A maximum drain current rating of 5A allows for effective handling of power levels in demanding applications without overheating.

No. of Terminals: 2

The dual terminal design simplifies circuit connections, enhancing ease of use for designers and engineers.

Maximum Power Dissipation (Abs): 73 W

With a maximum power dissipation capability of 73W, the FET can efficiently handle substantial power loads, making it reliable for high-performance applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to compact designs, making the transistor suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for high input impedance and low power consumption, which is advantageous for battery-powered and portable devices.

Maximum Operating Temperature: 165 °C

The ability to operate at high temperatures (up to 165 °C) ensures reliability and durability in harsh environments.

Transistor Element Material: SILICON

Silicon-based transistors are known for their strong performance, stability, and cost-effectiveness, contributing to their widespread usage.

Maximum Drain Current (ID): 5 A

Reiterating the maximum drain current of 5A ensures that this specification is central to its applicability in high-power applications.

Terminal Position: DUAL

The dual terminal position enhances connectivity options and supports versatile circuit designs.

Case Connection: SOURCE

Source connection facilitates direct interfacing with circuit components, streamlining assembly and troubleshooting processes.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54008S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54008S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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