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PD54008L

STMicroelectronics

PD54008L by STMicroelectronics

PD54008L by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 5 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This surface-mount device excels in high-power scenarios with a dissipation of up to 44 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,383 parts In-Stock

1+ parts

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4,383

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Vyrian

USA . 1,366 parts In-Stock

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1,366

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Anansix

USA . 1,353 parts In-Stock

1+ parts

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1,353

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,023 parts In-Stock

1+ parts

$0.987

100+ parts

-

1k+ parts

$0.888

10k+ parts

-

1,023

$0.987

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$0.888

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MKK Technologies

India . 1,060 parts In-Stock

1+ parts

$1.856

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1,060

$1.856

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DigiPath Technology Company

USA . 1,060 parts In-Stock

1+ parts

$1.856

100+ parts

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1,060

$1.856

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Corphita

USA . 3,478 parts In-Stock

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3,478

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Parana Technologies

USA . 1,115 parts In-Stock

1+ parts

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100+ parts

$1.180

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1,115

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$1.180

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Overview

Unlock unparalleled performance with the PD54008L RF Power FET from STMicroelectronics, a leader in semiconductor innovation. Designed for amplifier applications, this N-channel transistor excels in ultra-high frequency environments, delivering remarkable power efficiency and reliability. Its compact, surface-mount design ensures seamless integration in diverse electronics, empowering your projects with enhanced functionality and superior thermal management. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, enhancing the reliability of the FET in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for higher efficiency and faster switching capabilities, making them ideal for high-performance amplifier applications.

Configuration: SINGLE

A single configuration simplifies circuit design and integration, making it easier to implement in compact electronic devices.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET can effectively boost signal strength, making it suitable for audio and radio frequency applications.

Surface Mount: YES

Being surface mount allows for compact assembly and improved performance due to shorter lead lengths, which minimizes inductance.

Minimum DS Breakdown Voltage: 25 V

A minimum breakdown voltage of 25 V provides increased safety against voltage spikes, making it suitable for robust applications.

Package Shape: SQUARE

The square package shape provides a uniform footprint, making it easier to place on PCBs and facilitating automated assembly.

Terminal Form: NO LEAD

No lead design allows for a compact size and enhanced thermal performance, ideal for high-frequency applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation typically leads to better performance in terms of efficiency and output, especially in signal amplification.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for UHF applications ensures effective performance in advanced communication systems, like wireless transmitters and receivers.

Maximum Drain Current (Abs) (ID): 4 A

A maximum drain current of 4 A allows for handling substantial power levels, making it versatile for many high-power applications.

No. of Terminals: 5

Having 5 terminals facilitates more flexible circuit configurations, allowing for efficient signal and power connections.

Maximum Power Dissipation (Abs): 44 W

A power dissipation capability of 44 W makes this FET suitable for high-power applications without overheating issues.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging optimizes electrical performance, making it ideal for applications requiring minimal package inductance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent efficiency and fast switching speeds, ensuring high-performance characteristics in RF applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C expands the range of applications and enhances reliability in extreme conditions.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its excellent electrical characteristics and reliability in FETs.

Terminal Finish: TIN LEAD

Tin lead finish provides reliable soldering qualities, ensuring strong connections on PCBs and enhancing longevity.

Maximum Drain Current (ID): 5 A

With a maximum drain current capability of 5 A, this FET is suitable for handling demanding loads, ensuring optimal performance.

Terminal Position: QUAD

Quad terminal positioning allows for versatile circuit designs and configurations, giving designers flexibility in layout.

Case Connection: SOURCE

Direct source connection facilitates easier implementation in circuits, ensuring efficient signal flow and performance.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54008L attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N5

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54008L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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