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STAC4932F

STMicroelectronics

STAC4932F by STMicroelectronics

STAC4932F by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a 200V min breakdown voltage, operates in the ultra-high frequency band, and supports surface mount technology. With a max temp of 200 °C, it's ideal for high-performance circuits.

Median Price

$88.210

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11 parts In-Stock

1+ parts

$85.920

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11

$85.920

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Verical

USA . 11 parts In-Stock

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$85.920

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11

$85.920

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Chip1Stop

Japan . 11 parts In-Stock

1+ parts

$90.500

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11

$90.500

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DigiKey

USA . 67 parts In-Stock

1+ parts

$117.570

100+ parts

$104.062

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67

$117.570

$104.062

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,209 parts In-Stock

1+ parts

$80.702

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3,209

$80.702

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Vyrian

USA . 3,507 parts In-Stock

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3,507

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Anansix

USA . 1,628 parts In-Stock

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1,628

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 165 parts In-Stock

1+ parts

$1.019

100+ parts

-

1k+ parts

$0.917

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165

$1.019

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$0.917

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MKK Technologies

India . 530 parts In-Stock

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$1.917

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530

$1.917

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DigiPath Technology Company

USA . 530 parts In-Stock

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$1.917

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530

$1.917

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Corphita

USA . 2,681 parts In-Stock

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$76.455

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2,681

$76.455

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QUARKTWIN TECHNOLOGY LTD

USA . 21,920 parts In-Stock

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21,920

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Microchip USA

USA . 4,925 parts In-Stock

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4,925

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Parana Technologies

USA . 504 parts In-Stock

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$1.219

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504

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$1.219

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Overview

Elevate your RF applications with the STAC4932F from STMicroelectronics—a leader in innovative semiconductor solutions. This high-quality N-channel FET delivers exceptional performance in ultra-high frequency amplifiers, ensuring reliable signal integrity and superior efficiency. With its robust ceramic-metal sealed package, it thrives in demanding environments, providing customers with unmatched durability and value. Experience seamless integration and elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed design ensures excellent thermal performance and reliability in demanding applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility, resulting in better performance and efficiency for amplification tasks.

Configuration: SINGLE

A single configuration allows for easier design integration while providing sufficient power amplification in compact systems.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is optimized for signal integrity and strength, making it ideal for RF applications.

Surface Mount: YES

Surface mount capability allows for compact PCB designs, efficient heat dissipation, and faster assembly processes.

Minimum DS Breakdown Voltage: 200 V

With a minimum breakdown voltage of 200 V, this FET can handle high voltages, enhancing system reliability and performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization and better thermal management on PCBs.

Terminal Form: FLAT

Flat terminals promote optimal soldering and heat dissipation, ensuring robust connections in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables low gate voltage operation, leading to lower power consumption and improved device efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra-high frequency band, this FET is ideal for modern communication systems and RF applications.

No. of Terminals: 4

The four terminals offer straightforward connection options, simplifying integration into various circuit designs.

Package Style (Meter): FLATPACK

The flatpack package style saves space and enhances thermal management, making it suitable for high-density applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, ideal for sensitive amplification tasks.

Maximum Operating Temperature: 200 °C

A high maximum operating temperature allows for reliable performance in extreme environments, ensuring long-term stability.

Transistor Element Material: SILICON

Silicon offers excellent electronic properties and thermal conductivity, making this FET solid for various applications.

Terminal Position: DUAL

Dual terminal positioning facilitates efficient signal routing and can improve the overall layout of the circuit board.

Case Connection: SOURCE

Direct connectivity to the source enhances performance in RF amplification, contributing to overall system efficiency.

Technical Specifications

RF Power Field Effect Transistors (FET) STAC4932F attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

200 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFP-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

STAC4932F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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