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STAC1011-350

STMicroelectronics

STAC1011-350 by STMicroelectronics

STAC1011-350 by STMicroelectronics is a N-channel RF FET with 80V DS breakdown voltage. It operates in enhancement mode for L band applications, featuring a plastic/epoxy package and flat terminals. Ideal for amplifier circuits, this single configuration transistor is surface mountable with source connection in a rectangular flange mount package.

Median Price

$158.120

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

1+ parts

$158.120

100+ parts

-

1k+ parts

-

10k+ parts

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4

$158.120

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 142 parts In-Stock

1+ parts

$152.589

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$152.589

-

-

-

Vyrian

USA . 6,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,971

-

-

-

-

Anansix

USA . 1,578 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,578

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,458 parts In-Stock

1+ parts

$0.945

100+ parts

-

1k+ parts

$0.850

10k+ parts

-

1,458

$0.945

-

$0.850

-

MKK Technologies

India . 348 parts In-Stock

1+ parts

$1.777

100+ parts

-

1k+ parts

-

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348

$1.777

-

-

-

DigiPath Technology Company

USA . 348 parts In-Stock

1+ parts

$1.777

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$1.777

-

-

-

Advanced Electronics

New Zealand . 31 parts In-Stock

1+ parts

$2.328

100+ parts

$2.118

1k+ parts

$1.909

10k+ parts

-

31

$2.328

$2.118

$1.909

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Corphita

USA . 1,243 parts In-Stock

1+ parts

$144.558

100+ parts

-

1k+ parts

-

10k+ parts

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1,243

$144.558

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Microchip USA

USA . 6,984 parts In-Stock

1+ parts

$285.615

100+ parts

-

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-

10k+ parts

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6,984

$285.615

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Component Stockers USA

USA . 29 parts In-Stock

1+ parts

$3,707.010

100+ parts

-

1k+ parts

-

10k+ parts

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29

$3,707.010

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-

-

Parana Technologies

USA . 1,107 parts In-Stock

1+ parts

-

100+ parts

$1.130

1k+ parts

-

10k+ parts

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1,107

-

$1.130

-

-

Overview

Unlock the power of cutting-edge technology with the STAC1011-350 by STMicroelectronics. This RF Power Field Effect Transistor (FET) offers unparalleled quality and performance, backed by a trusted manufacturer. Ideal for amplifier applications in the L Band frequency range, this single configuration transistor provides enhanced efficiency and reliability. With a minimum DS breakdown voltage of 80V and a durable plastic/epoxy package body, the STAC1011-350 delivers exceptional value and benefits to customers seeking top-notch RF power solutions. Elevate your projects with this high-quality component from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

Offers lower conduction losses and higher efficiency compared to P-channel transistors, making it ideal for high-power applications.

Configuration: SINGLE

Simplifies circuit design and integration, making the transistor easy to use for various amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplification of signals, providing high gain and low noise for improved signal quality.

Surface Mount: YES

Facilitates easy PCB assembly and saves space, making it suitable for compact electronic devices.

Minimum DS Breakdown Voltage: 80 V

Ensures safe operation under high voltage conditions, making the transistor reliable for use in power amplifiers.

Package Shape: RECTANGULAR

Allows for efficient heat dissipation and easy mounting on a PCB or heatsink.

Terminal Form: FLAT

Enables secure soldering connections, improving the reliability and performance of the transistor in the circuit.

Operating Mode: ENHANCEMENT MODE

Provides enhanced control over the transistor's conduction, allowing for precise amplification of signals.

Highest Frequency Band: L BAND

Supports high-frequency signal amplification, making it suitable for applications in the L band frequency range.

No. of Terminals: 2

Simplifies circuit connections and reduces complexity in PCB layouts, improving overall system integration.

Package Style (Meter): FLANGE MOUNT

Facilitates secure mounting on a PCB or heatsink, ensuring stable operation under high-power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides efficient switching characteristics and low on-state resistance, enhancing the overall performance of the transistor.

Transistor Element Material: SILICON

Offers high breakdown voltage and temperature stability, making the transistor suitable for demanding applications.

Terminal Position: DUAL

Facilitates easy connection to external circuits and devices, improving the versatility of the transistor in different applications.

Case Connection: SOURCE

Allows for efficient heat dissipation and improved thermal management, ensuring reliable performance under high-power conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) STAC1011-350 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

STAC1011-350 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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