Loading...

PTVA101K02EVP1

Infineon Technologies

PTVA101K02EVP1 by Infineon Technologies

Infineon's PTVA101K02EVP1 is an N-CHANNEL RF Power FET with 105V DS Breakdown Voltage, suitable for L BAND applications. It features COMMON SOURCE configuration, METAL-OXIDE SEMICONDUCTOR tech, and operates in ENHANCEMENT MODE. This FLANGE MOUNT transistor has a max temp of 200°C and is ideal for AMPLIFIER use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,305

-

-

-

-

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

Digiode

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 8,907 parts In-Stock

1+ parts

$1.792

100+ parts

$1.720

1k+ parts

$1.649

10k+ parts

-

8,907

$1.792

$1.720

$1.649

-

AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$10.529

100+ parts

-

1k+ parts

-

10k+ parts

-

654

$10.529

-

-

-

Continental Prestige Electronics

USA . 3,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,025

-

-

-

-

Argo Parts USA

USA . 2,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,190

-

-

-

-

Corphita

USA . 253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

253

-

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Experience unparalleled performance and reliability with the PTVA101K02EVP1 from Infineon Technologies. As a leader in RF Power Field Effect Transistors, Infineon ensures top-notch quality and cutting-edge technology in all their products. This N-CHANNEL transistor is ideal for amplifier applications in the L Band, offering enhanced efficiency and power capabilities. With a ceramic, metal-sealed package and high DS breakdown voltage of 105V, this transistor guarantees superior performance and longevity. Trust Infineon to deliver unmatched value and benefits with the PTVA101K02EVP1, empowering you to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for rugged environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better conductivity and efficiency compared to P-channel types, making this product more efficient in power applications.

Configuration: COMMON SOURCE, 2 ELEMENTS

Common source configuration allows for easy integration into amplifier circuits, and the presence of 2 elements provides redundancy and stability.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal boosting.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 105 V

The high breakdown voltage ensures reliable operation under high voltage conditions, making it suitable for power applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into electronic systems.

Terminal Form: FLAT

Flat terminals make soldering and connecting the transistor to circuit boards convenient and secure.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers better control over switching characteristics, improving overall performance.

Highest Frequency Band: L BAND

Designed for the L band frequency range, making it ideal for applications in this specific frequency band.

No. of Elements: 2

Presence of 2 elements provides redundancy and enhances stability in amplifier circuits.

No. of Terminals: 4

4 terminals provide flexibility in circuit design and help in connecting the transistor securely.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for secure mounting in place, suitable for applications requiring stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and efficiency in power applications.

Maximum Operating Temperature: 200 °C

High maximum operating temperature ensures the transistor can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon material offers good conductivity and reliability, making it suitable for power transistor applications.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and connections, enhancing usability.

Case Connection: SOURCE

Source case connection ensures efficient grounding and heat dissipation, critical for power applications.

Technical Specifications

RF Power Field Effect Transistors (FET) PTVA101K02EVP1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

105 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PTVA101K02EVP1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20