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PTVA101K02EVV1R250

Infineon Technologies

PTVA101K02EVV1R250 by Infineon Technologies

Infineon's PTVA101K02EVV1R250 is an N-CHANNEL RF Power FET with 105V DS Breakdown Voltage, 17dB Power Gain, and L BAND frequency. It's a COMMON SOURCE transistor for AMPLIFIER applications in ENHANCEMENT MODE. The package is CERAMIC/METAL-SEALED COFIRED, RECTANGULAR shape, FLANGE MOUNT style with 4 terminals and max temp of 225°C.

Median Price

$703.162

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 250 parts In-Stock

1+ parts

$703.162

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250

$703.162

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Vyrian

USA . 7,778 parts In-Stock

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7,778

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Digiode

USA . 286 parts In-Stock

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286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 23,775 parts In-Stock

1+ parts

$0.747

100+ parts

$0.717

1k+ parts

$0.687

10k+ parts

-

23,775

$0.747

$0.717

$0.687

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AZTECH Wire

Italy . 1,136 parts In-Stock

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$16.041

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1,136

$16.041

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Ampacity Inc.

Singapore . 528 parts In-Stock

1+ parts

$20.050

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528

$20.050

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Argo Parts USA

USA . 6,846 parts In-Stock

1+ parts

$703.162

100+ parts

$696.131

1k+ parts

$689.099

10k+ parts

$682.068

6,846

$703.162

$696.131

$689.099

$682.068

Continental Prestige Electronics

USA . 6,133 parts In-Stock

1+ parts

$703.162

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$689.099

6,133

$703.162

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$689.099

QUARKTWIN TECHNOLOGY LTD

USA . 27,882 parts In-Stock

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Microchip USA

USA . 6,464 parts In-Stock

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6,464

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Netroflash

USA . 1,050 parts In-Stock

1+ parts

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100+ parts

$689.099

1k+ parts

$668.004

10k+ parts

$653.941

1,050

-

$689.099

$668.004

$653.941

Corphita

USA . 610 parts In-Stock

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610

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Overview

Experience unparalleled performance and reliability with the PTVA101K02EVV1R250 RF Power Field Effect Transistor from Infineon Technologies. As a leading manufacturer in the industry, Infineon brings you cutting-edge technology for amplifier applications in the L Band frequency range. With a minimum DS breakdown voltage of 105 V and a power gain of 17 dB, this N-CHANNEL transistor offers exceptional quality and efficiency. Whether you're in need of high power amplification or superior signal processing, the PTVA101K02EVV1R250 delivers unmatched value and benefits to meet your specific needs. Elevate your projects to the next level with this innovative solution.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for high-performance applications in challenging environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency compared to P-channel FETs, making this product a good choice for power amplification.

Minimum DS Breakdown Voltage: 105 V

The high breakdown voltage ensures safe operation and protection against voltage spikes, making this product suitable for demanding applications.

Minimum Power Gain (Gp): 17 dB

A high power gain means that the transistor amplifies signals effectively, providing clear and strong output, making it ideal for amplifier applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and easy control of the channel, making them suitable for precise amplification and switching applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low input capacitance, high switching speed, and high power efficiency, making this product a reliable choice for power amplification.

Maximum Operating Temperature: 225 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without degradation, ensuring reliable performance in various operating conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) PTVA101K02EVV1R250 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

105 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Minimum Power Gain (Gp):

17 dB

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PTVA101K02EVV1R250 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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