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SD2933W

STMicroelectronics

SD2933W by STMicroelectronics

SD2933W by STMicroelectronics is an N-CHANNEL RF Power FET with a max drain current of 40A and power dissipation of 648W. It operates at up to 200 °C, making it suitable for high-power applications in surface-mount configurations.

Median Price

$121.230

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,832 parts In-Stock

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$93.080

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2,832

$93.080

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Arrow

USA . 2,832 parts In-Stock

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$96.590

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2,832

$96.590

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Chip1Stop

Japan . 1,788 parts In-Stock

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$121.230

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1,788

$121.230

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DigiKey

USA . 150 parts In-Stock

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$135.890

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$109.466

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150

$135.890

$109.466

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Mouser Electronics

USA . 5 parts In-Stock

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$139.670

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5

$139.670

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Distributors (In-Stock)

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Digiode

USA . 1,074 parts In-Stock

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$115.168

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1,074

$115.168

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Vyrian

USA . 5,414 parts In-Stock

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5,414

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Anansix

USA . 2,831 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,620 parts In-Stock

1+ parts

$1.122

100+ parts

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1k+ parts

$1.010

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1,620

$1.122

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$1.010

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MKK Technologies

India . 372 parts In-Stock

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$2.111

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372

$2.111

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DigiPath Technology Company

USA . 372 parts In-Stock

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$2.111

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372

$2.111

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Corphita

USA . 2,215 parts In-Stock

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$109.107

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2,215

$109.107

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Microchip USA

USA . 7,971 parts In-Stock

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$186.750

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7,971

$186.750

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QUARKTWIN TECHNOLOGY LTD

USA . 10,437 parts In-Stock

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Parana Technologies

USA . 846 parts In-Stock

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$1.342

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846

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$1.342

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Futuretech Components

Singapore . 500 parts In-Stock

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Kepictronics

USA . 300 parts In-Stock

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300

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RC Electronics

USA . 245 parts In-Stock

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245

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Overview

Elevate your electronics with the SD2933W RF Power Field Effect Transistor by STMicroelectronics. Known for their high-quality components, STMicroelectronics offers top-tier products that deliver unparalleled performance. The SD2933W is a game-changer in the industry, offering a single-channel configuration with a maximum drain current of 40A and a power dissipation of 648W. Ideal for a wide range of applications, this N-channel FET utilizes metal-oxide semiconductor technology to ensure reliable and efficient operation. Upgrade your projects with the SD2933W and experience the superior value and benefits that only STMicroelectronics can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower on-resistance and higher efficiency compared to P-CHANNEL FETs, making them ideal for high-power applications.

Configuration: SINGLE

Single configuration FETs are simpler to design with and easier to control, making them suitable for basic power amplification circuits.

Surface Mount: YES

Surface mount FETs are easier to design with on modern circuit boards, allowing for more compact and efficient layouts.

Maximum Drain Current (Abs) (ID): 40 A

With a high maximum drain current, this FET can handle large amounts of power without overheating or failing, making it reliable for high-power applications.

Maximum Power Dissipation (Abs): 648 W

The high maximum power dissipation allows this FET to handle high power levels without damage, making it suitable for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good performance and high efficiency, making them a popular choice for power amplifier applications.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring reliability in harsh environments.

Technical Specifications

RF Power Field Effect Transistors (FET) SD2933W attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

200 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SD2933W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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