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SD2920

STMicroelectronics

SD2920 by STMicroelectronics

SD2920 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max DS breakdown voltage of 125V, operates at very high frequencies, and supports a drain current of up to 13.9A. Its robust ceramic-metal sealed package ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,902 parts In-Stock

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1,902

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Digiode

USA . 902 parts In-Stock

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902

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Vyrian

USA . 792 parts In-Stock

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792

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,872 parts In-Stock

1+ parts

$1.519

100+ parts

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1k+ parts

$1.367

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1,872

$1.519

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$1.367

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MKK Technologies

India . 764 parts In-Stock

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$2.856

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764

$2.856

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DigiPath Technology Company

USA . 764 parts In-Stock

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$2.856

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764

$2.856

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Corphita

USA . 1,122 parts In-Stock

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1,122

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Parana Technologies

USA . 1,043 parts In-Stock

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$1.816

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1,043

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$1.816

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Overview

Elevate your RF applications with the SD2920 from STMicroelectronics, a trusted leader in semiconductor solutions. This high-performance N-channel FET excels as an amplifier, delivering superior efficiency and reliability in very high frequency environments. With a robust ceramic, metal-sealed package designed for durability, the SD2920 ensures optimal performance even under extreme conditions. Choose STMicroelectronics for quality you can trust and unlock the full potential of your designs today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of a ceramic, metal-sealed co-fired package enhances durability and protects the transistor from environmental factors, making it suitable for demanding applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their higher electron mobility, resulting in faster switching speeds and better performance in applications like RF amplification.

Configuration: SINGLE

A single transistor configuration simplifies design and reduces board space requirements, making it easier to integrate into various systems.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor can effectively increase signal strength, making it ideal for RF communication and broadcasting applications.

Minimum DS Breakdown Voltage: 125 V

A minimum voltage of 125 V ensures that this FET can operate safely and efficiently in high-voltage applications without breakdown, providing reliability.

Package Shape: ROUND

The round package shape often facilitates better thermal performance and can accommodate various mounting configurations, enhancing versatility.

Terminal Form: FLAT

Flat terminals promote better contact with the circuit board and allow for efficient heat dissipation, which is crucial for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer low leakage current and improved efficiency during operation, making them advantageous for battery-operated devices.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

The capability to operate in very high frequency (VHF) bands makes this FET suitable for advanced RF applications like cellular communications and satellite transceivers.

No. of Terminals: 4

Having four terminals allows for additional connections which can facilitate more complex circuits and provide options for enhanced circuit integration.

Package Style (Meter): FLANGE MOUNT

Flange mount packages offer secure mounting options, contributing to durability and stability in high-performance environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation, low power consumption, and greater scalability, making it a preferred choice for modern electronic applications.

Maximum Operating Temperature: 200 °C

An impressive maximum operating temperature of 200 °C indicates excellent thermal stability, allowing use in high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon as the element material provides reliable performance, availability, and consistent characteristics across a wide range of applications.

Maximum Drain Current (ID): 13.9 A

The ability to handle up to 13.9 A of drain current means this transistor is capable of driving substantial loads, making it suitable for power-intensive applications.

Terminal Position: RADIAL

Radial terminal positioning allows for efficient space utilization on printed circuit boards (PCBs) and can facilitate better cable management in installations.

Technical Specifications

RF Power Field Effect Transistors (FET) SD2920 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Configuration:

Minimum DS Breakdown Voltage:

125 V

Maximum Drain Current (ID):

13.9 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

O-CRFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD2920 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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