Loading...

BLF6G15LS-500H

NXP Semiconductors

BLF6G15LS-500H by NXP Semiconductors

BLF6G15LS-500H by NXP is an N-channel RF power FET designed for switching applications. It features a max drain current of 45 A, a breakdown voltage of 100 V, and operates in the L band. Its flatpack design ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Digiode

USA . 3,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,450

-

-

-

-

Anansix

USA . 2,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,624

-

-

-

-

Vyrian

USA . 136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

136

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 30 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$1.920

-

-

-

Northwest PG Solutions

USA . 128 parts In-Stock

1+ parts

$2.112

100+ parts

-

1k+ parts

-

10k+ parts

-

128

$2.112

-

-

-

One Stop Electronics

USA . 859 parts In-Stock

1+ parts

$9.050

100+ parts

-

1k+ parts

-

10k+ parts

-

859

$9.050

-

-

-

UNI Independent Distributors

Spain . 5,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,445

-

-

-

-

Corphita

USA . 3,661 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,661

-

-

-

-

Perfect Parts

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

125

-

-

-

-

Overview

Unlock exceptional performance with the BLF6G15LS-500H from NXP Semiconductors, a leader in innovative RF technology. This robust N-channel RF Power FET delivers impressive switching capabilities, perfect for high-frequency applications. Its durable ceramic and metal-sealed design ensures reliability, while its efficient enhancement mode operation maximizes power output. Elevate your projects with a trusted solution that brings unmatched quality and versatility to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package ensures robust protection, allowing the transistor to operate reliably in demanding environments.

Polarity or Channel Type: N-CHANNEL

N-channel configuration provides higher efficiency and better performance for switching applications, making it suitable for a variety of RF power applications.

Configuration: COMMON SOURCE, 2 ELEMENTS

The common source configuration enhances voltage gain and power output, ideal for amplifying or switching high-frequency signals.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in rapidly turning on and off, providing control over RF signals with minimal delay.

Surface Mount: YES

Surface mount capability facilitates simplified assembly and helps in saving space on PCBs, while improving overall performance due to shorter signal paths.

Minimum DS Breakdown Voltage: 100 V

With a breakdown voltage of 100 V, this transistor can handle high-voltage conditions, making it suitable for a variety of demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage and helps in the thermal management of the device, enhancing overall reliability.

Terminal Form: FLAT

Flat terminal form provides a low-profile design that is beneficial for thermal dissipation and efficient integration into compact electronic systems.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for greater control and efficiency in switching applications, making it suitable for modern RF designs.

Highest Frequency Band: L BAND

Operating in the L band supports a wide range of communication applications, including satellite and radar systems, ensuring versatility.

No. of Elements: 2

Having two elements enables greater efficiency and flexibility in circuit design, which is advantageous for multi-channel applications.

No. of Terminals: 4

The four-terminal configuration allows for better connection options and improved performance in circuit designs, enhancing reliability.

Package Style (Meter): FLATPACK

The flatpack style design aids in space-efficient mounting and efficient heat dissipation, which is crucial for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high-speed operation with low on-resistance, leading to efficient power handling and energy savings.

Transistor Element Material: SILICON

Silicon as the element material provides excellent electrical characteristics and thermal stability, making it suitable for a variety of applications.

Maximum Drain Current (ID): 45 A

A maximum drain current of 45 A allows this transistor to handle high power applications effectively, ensuring reliability and performance.

Terminal Position: DUAL

Dual terminal positioning optimizes layout options on the PCB, enabling a more efficient design process.

Case Connection: SOURCE

The source case connection enhances thermal performance and ease of integration into various circuit topologies.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF6G15LS-500H attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

45 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDFP-F4

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BLF6G15LS-500H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20