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BLF6G27-10G

NXP Semiconductors

BLF6G27-10G by NXP Semiconductors

NXP Semiconductors' BLF6G27-10G is a single N-channel RF Power FET with 65V DS breakdown voltage. It operates in enhancement mode for S band applications, offering 3.5A max drain current and can withstand up to 225°C operating temperature. Ideal for amplifier circuits requiring high-frequency performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Chip Stock

USA . 20,500 parts In-Stock

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Flip Electronics

USA . 5,000 parts In-Stock

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Anansix

USA . 2,887 parts In-Stock

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2,887

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Digiode

USA . 1,021 parts In-Stock

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1,021

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Cyclops Electronics Ltd

UK . 650 parts In-Stock

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650

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Vyrian

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439

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EZ Electronic Parts

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200

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Speed Components Ltd

Israel . 110 parts In-Stock

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VNN

France . 35 parts In-Stock

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Corohmni

South Africa . 168 parts In-Stock

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$1.926

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One Stop Electronics

USA . 1,029 parts In-Stock

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$7.050

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Ampacity Inc.

Singapore . 879 parts In-Stock

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$38.050

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A-Z Elektronik GmbH

Germany . 6,884 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,589 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Perfect Parts

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Authorized Procurement Solutions

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Aranea Global

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GreenTree Electronics

Israel . 84 parts In-Stock

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84

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Overview

Unleash the power of cutting-edge RF technology with the BLF6G27-10G by NXP Semiconductors. Designed to deliver unmatched performance and reliability, this RF Power Field Effect Transistor is a game-changer in the amplifier industry. With a focus on quality and innovation, NXP Semiconductors has crafted a product that exceeds expectations in terms of efficiency and functionality. Whether you're looking to enhance your S Band applications or amplify your signals with precision, the BLF6G27-10G offers unparalleled value and benefits that will take your projects to new heights. Experience the difference with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides excellent heat dissipation and reliability, making this product suitable for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and faster switching speeds compared to P-channel FETs, making them ideal for amplifier applications where efficiency and performance are crucial.

Surface Mount: YES

Being surface mountable, this FET can be easily integrated into compact circuit designs, saving space and simplifying assembly processes.

Maximum Drain Current (Abs) (ID): 3.5 A

With a high maximum drain current rating of 3.5 A, this FET can handle high power levels effectively, making it suitable for demanding amplifier applications.

Maximum Operating Temperature: 225 °C

The high maximum operating temperature of 225°C ensures the FET can withstand elevated temperature environments, enhancing its reliability and longevity in operational conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF6G27-10G attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

3.5 A

Maximum Drain Current (ID):

3.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDSO-G2

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF6G27-10G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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