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MRF6S20010GNR1

NXP Semiconductors

MRF6S20010GNR1 by NXP Semiconductors

NXP's MRF6S20010GNR1 is a single N-channel RF FET with 68V DS breakdown voltage, ideal for amplifier applications in S band frequencies. It features a plastic/epoxy package, Gull Wing terminals, and operates in enhancement mode up to 225°C.

Median Price

$46.800

Lifecycle Status

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1k+

MRF6S20010GNR1 by NXP Semiconductors
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Chip1Stop

Japan . 6 parts In-Stock

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$54.000

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6

$54.000

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DigiKey

USA . 79 parts In-Stock

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$54.670

100+ parts

$42.427

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79

$54.670

$42.427

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Rochester

USA . 667 parts In-Stock

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$31.680

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$28.350

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$26.680

667

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$31.680

$28.350

$26.680

Verical

USA . 667 parts In-Stock

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$39.600

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$35.438

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$33.350

667

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$39.600

$35.438

$33.350

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Digiode

USA . 2,176 parts In-Stock

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$33.526

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$33.526

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Nova Conductors

Japan . 82 parts In-Stock

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$36.795

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Vyrian

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Anansix

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275

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Inventory MP

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50

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Bristol Electronics

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50

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59

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Aztec Data Supply Inc.

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Semicontronic

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One Stop Electronics

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Corphita

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$31.761

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Continental Prestige Electronics

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$36.795

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$36.060

690

$36.795

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$36.060

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Ampacity Inc.

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A-Z Elektronik GmbH

Germany . 6,704 parts In-Stock

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UNI Independent Distributors

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Authorized Procurement Solutions

USA . 1,800 parts In-Stock

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Perfect Parts

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Futuretech Components

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Overview

Unlock the power of seamless connectivity with the MRF6S20010GNR1 by NXP Semiconductors. Crafted with precision and excellence, this RF Power Field Effect Transistor delivers unparalleled performance in amplifier applications. Its N-CHANNEL configuration and ENHANCEMENT MODE operation ensure optimal results in the S BAND frequency range. With a durable plastic/epoxy package body and gull wing terminals, this transistor guarantees reliability and longevity. Experience top-tier quality and efficiency with the MRF6S20010GNR1, setting a new standard in RF technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower conduction losses and higher efficiency compared to P-CHANNEL FETs, making this product a good choice for high-performance applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and layout, making this FET easy to integrate into various amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET delivers high power output and efficient performance for amplifying signals.

Surface Mount: YES

The surface mount capability of this FET allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 68 V

With a minimum breakdown voltage of 68 V, this FET can handle high voltage levels without breakdown, ensuring reliable operation in various conditions.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor for this FET, allowing for efficient use of space on circuit boards.

Terminal Form: GULL WING

The gull wing terminal form offers secure and stable connections for the FET, minimizing the risk of mechanical failure or disconnection.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for easy control of the FET's conductivity, enabling precise adjustments in amplifier applications.

Highest Frequency Band: S BAND

Operating in the S band frequency range, this FET is designed for high-frequency applications, providing reliable performance in communication systems.

No. of Terminals: 2

With only two terminals, this FET is easy to integrate into circuit designs, reducing complexity and potential points of failure.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting of this FET on circuit boards, ensuring reliable performance in various operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOSFET technology, this FET offers high switching speeds and low on-resistance, making it ideal for high-performance amplifier applications.

Maximum Operating Temperature: 225 °C

With a maximum operating temperature of 225°C, this FET can withstand high temperature environments, ensuring stable performance under heat stress.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high reliability and performance, making this FET a durable and long-lasting choice for amplifier applications.

Terminal Finish: TIN

The tin terminal finish provides reliable electrical connections and corrosion resistance, ensuring stable performance over time.

Terminal Position: DUAL

With dual terminal positions, this FET offers flexibility in circuit design and layout, allowing for versatile integration in amplifier applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FET can withstand moderate exposure to moisture during storage and operation, ensuring reliability in various environments.

Case Connection: SOURCE

The source case connection provides a common ground reference for the FET, simplifying the circuit design and ensuring stable performance in amplifier applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, this FET can undergo reflow soldering processes efficiently, ensuring reliable solder joints for secure connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering of this FET on circuit boards, ensuring secure connections and stable performance.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF6S20010GNR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

68 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JEDEC-95 Code:

TO-270BA

JESD-30 Code:

R-PDFM-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF6S20010GNR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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